A kind of manufacturing method of partial thick copper pcb

Abstract

The present invention relates to the technical field of a PCB, and particularly relates to a manufacturing method of a locally thick copper PCB. The manufacturing method comprises the following steps: A, a step of preparation; B, a step of pasting primary dry films: pasting at least two layers of primary dry films in areas on a circuit board, where thick copper does not need to be plated, and carrying out exposure and development to expose areas where the thick copper needs to be plated; C, a step of locally plating the thick copper; D, a step of taking off the primary dry films; E, a step of pasting secondary dry films; F, a step of carrying out lead etching; and G, a step of taking of the secondary dry films. According to the manufacturing method disclosed by the present invention, a phenomenon of film clipping can be effectively avoided, and a local copper thickness can be made to be 2-3 oz and even greater according to the number of film pasting times, so that the difficult problem that the local copper thickness is greatly different from other areas to result in difficult production can be effectively solved; and moreover, the method is simple in manufacturing process, can well achieve local planting of the thick copper without special control, can be used for manufacturing products in batches, and cannot generate rejections basically, thereby enabling product yield to be very high and improving product quality.

Description

Technical field: [0001] The invention relates to the technical field of PCB boards, in particular to a method for manufacturing a locally thick copper PCB. Background technique: [0002] The design and application of existing circuit boards are becoming more and more specialized. Some circuit boards have inconsistent copper requirements for the circuit position table, and some areas require thicker copper plating than others. However, the production process in the prior art is only The copper thickness of the whole surface can be controlled to be consistent, and it is difficult to meet the requirements of special surface copper in local locations. At present, for the production of locally thick copper PCBs, especially PCBs with a height difference of more than 2oz (ounces), due to the limited copper thickness in the local thick copper areas, the production process is relatively complicated and the production difficult. The main production defects of this type of PCB are: 1. The ...

AI Technical Summary

Problems solved by technology

[0002] The design and application of the existing circuit boards are becoming more and more specialized. Some circuit boards have inconsistent copper requirements on the circuit positions and copper layers, and some parts require thicker copper plating than other parts. However, the production process in the prior art is only It can control the copper thickness of the whole surface to be consistent, and it is difficult to meet the special surface copper requirements of local positions

At present, for the production of local thick copper PCBs, especially PCBs with a height difference exceeding 2 oz (ounces), due to the limited copper thickness in the local thick copper area, the manufacturing process is relatively complicated and difficult to manufacture.

The main production defects of this type of PCB are: 1. The method of making PCB with high and low copper thickness is long. In order to achieve a local copper thickness that is thicker than other places, it is necessary to repeat the processes of electroplating, film sticking, film removal, and etching many times, and the process is complicated. , prone to defects and scrapping, low yield rate

2. The height difference area is easy to cause the secondary film to be weak, which will affect the product quality

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