Flexible epoxy resin composition

A technology of resin composition and epoxy resin, which is applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of low moisture resistance, poor peel strength, and decreased bonding strength, and achieve moisture resistance excellent effect

Active Publication Date: 2016-04-06
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, if the low-temperature curability is too much pursued, the peel strength may deteriorate
In addition, the curing agent contained in the conventional one-component

Method used

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  • Flexible epoxy resin composition
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Examples

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Embodiment

[0149] Hereafter, although an Example demonstrates this invention more concretely, this invention is not limited to the following Example. In addition, "part" in the following description means "part by mass".

[0150] [Preparation of one-component thermosetting resin composition]

[0151] Each resin composition having the compounding composition shown in Table 1 was prepared. After measuring the specified amount of materials shown in Table 1 in a plastic container, use an autorotation-revolution vacuum mixer Awatori Kotaro (manufactured by Shinki Corporation, ARE-250) to fully mix at room temperature (25° C.) at 2000 rpm, and then remove Soak for 1 minute to obtain the target resin composition.

[0152] It should be noted that the details of the materials used are as follows,

[0153] EXA4850-150: manufactured by DIC Corporation, vinyl ether modified bisphenol type epoxy resin) epoxy equivalent 450g / eq (equivalent to formula (1))

[0154] EXA4816: manufactured by DIC Corp...

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Abstract

Provided is a one-component thermosetting composition in which low-temperature curability and maintenance of adhesive strength are both obtained at the same time, and low-temperature curability and moisture resistance are both obtained at the same time. Specifically, a one-component-type thermosetting resin composition is provided containing tris(3-mercaptopropyl)isocyanurate and an epoxy resin containing an epoxy compound represented by formula (1) or formula (2) or a polymer thereof. (In formula (1) and formula (2), X, X1, and X2 may be mutually the same or different and are divalent non-aromatic hydrocarbon groups including two or more -(CH2)- units in a main backbone thereof (except when X is -O-CH2-CH(-OH)-CH2-); Ar, Ar1, and Ar2 may be mutually the same or different and are divalent aromatic-containing hydrocarbon groups including divalent aromatic groups in a main backbone thereof; and n and m are each independently an integer of 1-20).

Description

technical field [0001] The present invention relates to a one-component thermosetting resin composition containing tris(3-mercaptopropyl)isocyanurate and a specific epoxy resin. In addition, the present invention also relates to an adhesive and a sealing material comprising the one-component thermosetting resin composition, and a flexible cured epoxy resin obtained by heating the thermosetting resin composition. Background technique [0002] Epoxy resins have excellent properties in terms of mechanical properties, electrical properties, thermal properties, chemical resistance, and bonding strength, so they are widely used in coatings, electrical and electronic insulating materials, and adhesives. In recent years, in addition to the so-called two-component epoxy resin composition that is cured by mixing the epoxy resin and the curing agent during use, a one-component epoxy resin that is pre-mixed with the curing agent and cured by heat or the like has also been developed. ep...

Claims

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Application Information

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IPC IPC(8): C08G59/66C08L63/00C08L63/02C09J11/06C09J163/00C09K3/10
CPCC08G59/245C08G59/66C08L63/00C09J163/00C09K3/1006C08J3/24C08J3/247C09K3/12
Inventor 古田清敬服部硬介荻野启志增山学
Owner AJINOMOTO CO INC
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