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A mechanism for cleaning electroplated parts

A technology for parts and cleaning, applied in the field of mechanisms for cleaning electroplating parts, can solve the problems of low efficiency, difficult to wipe, high cost, and achieve the effect of ensuring safety and quality, ensuring qualified rate, and improving efficiency

Inactive Publication Date: 2018-08-03
DANYANG CITY XINGUANG ELECTRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the prior art, electroplated parts, such as nickel-plated parts, copper-plated parts, and silver-plated parts, generally have oil, dirt or a small amount of rust on the surface of these parts, which must be cleaned, but after cleaning by general methods, the surface of the workpiece still remains A very thin layer of floating ash affects the quality of subsequent processing. Sometimes it is necessary to use strong acid soaking to remove this layer of floating ash. There are usually mildew microorganisms in the floating ash. These microorganisms will cause some small white spots on the plated parts. Spots, and difficult to wipe off, affect the appearance of the product, and even lead to scrap
However, the existing technology uses soaking and drying for processing, and uses manual handling with gloves to minimize dust generation, and manually wipes the electroplated parts to remove dust, which wastes a lot of manpower and material resources, is inefficient, and the cost is high.

Method used

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  • A mechanism for cleaning electroplated parts

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0017] see figure 1 , a mechanism for cleaning electroplated parts, including sequentially connected feeding device 10, feeding valve 20, conveyor belt 30, cleaning device 40, discharging valve 50, electroplating tank 60.

[0018] Wherein, the cleaning device 40 is provided with a cleaning solution, and the conveyor belt 30 is arranged in the cleaning solution. The conveyor belt 30 is driven by a motor 70, and a dust removal bellows 55 is also provided between the ...

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Abstract

The present invention proposes a mechanism for cleaning electroplated parts. The mechanism for cleaning electroplated parts includes sequentially connected feeding devices, feeding valves, conveying belts, cleaning devices, discharge valves, and electroplating tanks. The cleaning device is provided with a cleaning liquid, the conveying belt is set in the cleaning liquid, the conveying belt is driven by a motor, and there is a dust removal bellows between the discharge valve and the electroplating tank. The dust-removing air box blows the high-speed ion wind to the electroplated parts from the top, and the ion wind is sucked out from the bottom of the dust-removing air box. The mechanism for cleaning electroplated parts of the present invention uses high-speed ion wind to blow away dust and remove mold, thereby ensuring the pass rate of parts that need to be electroplated, ensuring the safety and quality of subsequent processes, energy saving and environmental protection, and improving efficiency. Reduced costs.

Description

technical field [0001] The present invention relates to electroplating materials, and in particular to a mechanism for cleaning electroplated parts. Background technique [0002] Electroplating is a method of covering a conductor with a layer of metal using the principle of electrolysis. In addition to electrical conductors, electroplating can also be used on specially treated plastics. The electroplating process is basically as follows: connect the plated metal to the anode, connect the object to be plated to the cathode, and connect the cathode and anode with an electrolyte solution composed of positive ions of the plated metal. It will be oxidized (lose electrons), and the positive ions in the solution will be reduced (gain electrons) into atoms at the cathode and accumulate on the surface of the cathode. [0003] The main uses of electroplating include preventing metal oxidation (such as rust) and for decoration. The outer layer of many coins is also electroplated. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/08C25D19/00
Inventor 封毅
Owner DANYANG CITY XINGUANG ELECTRON