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Aluminum-based flexible circuit board manufacturing method

A technology of flexible circuit boards and manufacturing methods, which is applied in the direction of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of short working life of electronic components, poor heat dissipation function of flexible circuit boards, and poor reliability, etc., to extend life and reliability, good heat dissipation characteristics, and enhanced heat dissipation effect

Active Publication Date: 2016-04-27
SHENZHEN SUNTAK MULTILAYER PCB
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for manufacturing an aluminum-based flexible circuit board, which aims to solve the problems of short working life and poor reliability of electronic components caused by the poor heat dissipation function of the flexible circuit board in the prior art

Method used

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  • Aluminum-based flexible circuit board manufacturing method
  • Aluminum-based flexible circuit board manufacturing method
  • Aluminum-based flexible circuit board manufacturing method

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Embodiment Construction

[0040] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0041] Such as Figure 1 to Figure 3 As shown, it is a flow chart of the manufacturing method of the aluminum-based flexible circuit board provided by the embodiment of the present invention and a related schematic diagram of the aluminum-based flexible circuit board provided by the embodiment of the present invention, and the manufacturing method of the aluminum-based flexible circuit board provided by the embodiment of the present invention The method includes the following steps:

[0042] a. Making aluminum substrates, including:

[0043] According to the requirements of the processing drawing...

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Abstract

The invention is suitable for the circuit board manufacturing technology field and discloses an aluminum-based flexible circuit board manufacturing method. The method comprises steps that a, an aluminum substrate is manufactured, including rough shape cutting, positioning hole drilling, aluminum-based groove milling, groove hole grinding, aluminum-based coarsening, PP rough shape cutting, stitching, PP film pasting and laser cutting; b, a flexible circuit board is manufactured, including rough shape cutting, inner layer film drying, inner layer exposure, inner layer AOI, inner layer graph, target practice, stripping, soft board coarsening, covering film windowing, positioning hole drilling, laser cutting, covering film stitching, browning, gold plating and plasma glue removing; and c, stitching is carried out. According to the method, the aluminum substrate and the flexible circuit board are combined through a prepreg, so the whole aluminum-based flexible circuit board has excellent heat radiation characteristics, electronic components on the aluminum-based flexible circuit board can be prevented from being exposed in the high temperature environment, and service life and reliability are improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a method for manufacturing an aluminum-based flexible circuit board. Background technique [0002] The wearable development of electronic instruments and equipment has promoted the rapid development of flexible circuit boards. At the same time, with the continuous advancement of integration technology, the packaging density of electronic components and electronic equipment has become higher and higher. This trend has led to the development of flexible circuit boards in a limited volume More heat is generated. If the heat dissipation is not timely, the excessively accumulated heat will cause the working temperature of electronic components to rise rapidly, thereby affecting the working life and reliability of electronic components. Contents of the invention [0003] The purpose of the present invention is to provide a method for manufacturing an a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 宋建远刘东朱拓王淑怡
Owner SHENZHEN SUNTAK MULTILAYER PCB
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