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Packaging adhesive film for photovoltaic modules

A technology for encapsulating adhesive films and photovoltaic modules, applied in photovoltaic power generation, adhesives, electrical components, etc., can solve the problems of unfavorable development trends, limitations, and high cost of improvement in the photovoltaic industry, and improve the ability to resist potential potential-induced attenuation. The method is simple and low cost effect

Active Publication Date: 2016-05-04
GUANGZHOU BAIYUN CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the photovoltaic system, modules and cells all have an impact on the PID degree of photovoltaic modules, the anti-PID characteristics of photovoltaic groups can be improved by optimizing the array arrangement of photovoltaic modules, reducing the wet leakage current of modules, and optimizing the structure of cells , but the cost of these improvements is high, which is not conducive to the current development trend of cost reduction in the photovoltaic industry
[0005] For the EVA (ethylene-vinyl acetate copolymer) film, increasing its volume resistance can reduce the wet leakage current of the module, which has a certain effect on improving the anti-PID performance of the module, and the improvement cost is also low, but due to the influence of the PID of the module There are many factors, and the help of improving its bulk resistance is always limited

Method used

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  • Packaging adhesive film for photovoltaic modules
  • Packaging adhesive film for photovoltaic modules
  • Packaging adhesive film for photovoltaic modules

Examples

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Embodiment Construction

[0042] In order to better illustrate the content of the present invention, further description will be given below in conjunction with specific examples.

[0043] The raw materials used in the examples of the present invention are commercially available common raw materials except that the benzocrown derivatives in some examples are self-made.

[0044] The formula (parts by mass) of table 1 embodiment and comparative example

[0045]

[0046] (Remark)

[0047] Resin 1: Ethylene-vinyl acetate copolymer (EVA) with a vinyl acetate content of 28%, trade name: EVAVF024N00, purchased from Singapore TPC company;

[0048] Auxiliary 1: Formula II Represented benzocrown derivative; be vinyl benzo-15-crown-5, its preparation method is: (1) add 0.2molNaOH, 200ml dimethylformamide (DMF) and 0.1mol diethylene glycol dichloroethyl ether (purchased from TCI (Shanghai) Chemical Industry Development Co., Ltd.), quickly added 3,4-dihydroxyacetophenone (CAS number: 1197-09- 7) 0.1 mol, ...

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Abstract

The invention discloses a packaging adhesive film for photovoltaic modules. The raw materials of the packaging adhesive film comprise, by weight, 100 parts of an ethylene-vinyl acetate copolymer, 0.5-1.5 parts of a crosslinking agent, and 0.1-1.5 parts of a benzo-crown ether derivative represented by a formula I. In the formula I, m and n are integers selected from 0-2, and m and n are not simultaneously 0 and 2. R is a group containing carbon-carbon double bond. The benzo-crown ether derivative added in the photovoltaic module packaging adhesive film can form stable complex with metal ions such as sodium ions and calcium ions in photovoltaic glass, such that the immigration of the metal ions under high-voltage and humid environments can be reduced. Therefore, a purpose of effectively improving photovoltaic module capacity of resisting latent potential induced attenuation can be achieved.

Description

technical field [0001] The invention relates to the field of photovoltaic module packaging, in particular to a packaging adhesive film for photovoltaic modules. Background technique [0002] The abbreviation of Potential-induced degradation (Potential-induced degradation) is PID, which was first discovered by Sunpower in 2005. It refers to the long-term high voltage of the components that causes leakage current between the glass and the packaging material, and a large amount of charge accumulates on the surface of the cell, which deteriorates the passivation effect of the cell surface, resulting in fill factor, short-circuit current density and no-load voltage. Reduced, the performance of the components is lower than the design standard, and the photoelectric conversion efficiency is greatly reduced, and the decline can reach 80-90% in severe cases. [0003] From the perspective of the power attenuation mechanism of the cell, there are currently three main reasons: one is t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J123/08C09J11/06H01L31/048
CPCY02E10/50C09J7/00C08K5/00C08K5/15C08K5/20C08K5/205C09J11/06C09J123/0853C09J2423/04H01L31/0481
Inventor 石俊杰陈精华张健臻陈建军黄恒超
Owner GUANGZHOU BAIYUN CHEM IND