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A kind of production technology of double-sided pcb board

A technology of PCB board and production process, applied in the field of production process of double-sided PCB board, can solve the problems of complicated production process and high production cost, and achieve the effect of excellent oxidation resistance, good air tightness and no burr.

Active Publication Date: 2019-06-25
湖北碧辰科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the production process of the existing double-sided PCB board is relatively complicated, and the production cost is relatively high.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A kind of production technology of double-sided PCB board, comprises the following steps:

[0037] (1) Double-sided copper foil substrate pretreatment: Cut the double-sided copper foil substrate to the required size according to the layout diagram, then open positioning holes at the edge of the double-sided copper foil substrate, and finally make the two sides of the double-sided copper foil substrate Carry out surface pickling, surface brushing, water washing and drying in sequence;

[0038] (2) Line coating exposure treatment: use an ink coating wheel to coat a photosensitive ink layer on the surface of the double-sided copper foil substrate, and perform baking and drying treatment on the photosensitive ink layer, and finally dry the double-sided copper foil substrate. Line film exposure processing;

[0039] (3) Line development, etching, and ink removal treatment: place the double-sided copper foil substrate in a developing machine for development treatment, develop...

Embodiment 2

[0055] The difference between this embodiment and embodiment 1 is:

[0056] The acidic solution used in the pickling treatment in the step (1) and the step (4) is a sulfuric acid solution with a mass concentration of 4%; the surface scrubbing treatment in the step (1) and the step (4) uses a 500-mesh nylon mill Brush for scrubbing.

[0057] The thickness of the photosensitive ink layer in the step (2) is 9um, the baking and drying equipment used is a tunnel furnace, the baking temperature is 125°C, and the baking speed is 5m / min; The thickness of the solder resist ink layer is 25um, the baking and drying equipment used is a tunnel furnace, the baking temperature is 105°C, and the baking speed is 5m / min.

[0058] The exposure energy scale is controlled at 8 grids when the line film exposure treatment is performed in the step (2); the exposure energy scale is controlled at 9 grids when the solder resist film exposure treatment is performed in the step (4).

[0059] In the step...

Embodiment 3

[0066] The difference between this embodiment and embodiment 1 is:

[0067] The acidic solution used in the pickling treatment in the step (1) and the step (4) is a sulfuric acid solution with a mass concentration of 5%; the surface scrubbing treatment in the step (1) and the step (4) uses a 500-mesh nylon mill Brush for scrubbing.

[0068] The thickness of the photosensitive ink layer in the step (2) is 11um, the baking and drying equipment used is a tunnel furnace, the baking temperature is 125°C, and the baking speed is 5m / min; The thickness of the solder resist ink layer is 28um, the baking and drying equipment used is a tunnel furnace, the baking temperature is 105°C, and the baking speed is 5m / min.

[0069] The exposure energy scale is controlled at 8 grids when the line film exposure treatment is performed in the step (2); the exposure energy scale is controlled at 10 grids when the solder resist film exposure treatment is performed in the step (4).

[0070] The mass ...

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PUM

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Abstract

The invention relates to the technical field of PCBs, in particular to a production technology of a double-sided PCB. The technology sequentially comprises the following steps: double-sided copper foil substrate pretreatment, line coating and exposure treatment, line development, etching, de-inking treatment, solder resist pretreatment, solder resist development, lettering treatment, molding treatment, testing and antioxidant treatment. A copper foil substrate is subjected to surface polish-brush treatment through a polish-brush; a photosensitive ink layer and a solder resist ink layer coat the surface of the copper foil substrate; relatively high adsorption force is provided among the photosensitive ink layer, the solder resist ink layer and the copper foil substrate; the photosensitive ink layer and the solder resist ink layer are good in quality; and the produced PCB is good in quality. Cutting treatment is carried out on the copper foil substrate by a V-Cut technology; and the minimum thickness of the formed substrate corresponding to a V-shaped plate-dividing groove is controlled at 0.4-0.5mm, so that subsequent plate division is facilitated; and no burr is left.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a production process of double-sided PCB boards. Background technique [0002] PCB board, also known as printed circuit board, printed circuit board, or printed board for short, uses an insulating board as the base material, cuts to a certain size, has at least one conductive pattern attached to it, and is equipped with holes (such as component holes, fastening holes, metallized holes, etc.), and realize the interconnection between electronic components. Since such boards are made using electronic printing, they are called "printed" circuit boards. [0003] Double-sided PCB board is a very important kind of PCB board in circuit boards. There are double-sided circuit board metal base PCB boards, Hi-Tg heavy copper foil circuit boards, flat and winding double-sided circuit boards, and high-frequency PCB boards on the market. PCB, mixed dielectric base high-frequency double-sid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K3/02
CPCH05K3/022H05K3/06H05K2203/0228H05K2203/025
Inventor 刘诚胡锦程王福青
Owner 湖北碧辰科技股份有限公司
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