Preparation method of anti-sulfur chip LED (Light Emitting Diode) packaging adhesive

A technology of LED encapsulation and vulcanization patch, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of poor vulcanization resistance, poor vulcanization resistance of encapsulant, and poor air tightness of encapsulant. , to achieve the effect of delaying vulcanization, adsorption and elimination of oxidizing substances, and improving air tightness

Active Publication Date: 2016-05-11
GUANGDONG JIEGUO NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the SMD LED encapsulation adhesive generally has the disadvantage of poor vulcanization resistance, which is related to the air permeability and oxygen permeability of the encapsulation adhesive. Due to the poor air tightness of the encapsulation adhesive, some oxidizing substances from the outside world can penetrate into the encapsulation adhesive. , reacts with the silver-plated layer at the bottom of the encapsulant, which deteriorates the vulcanization resistance of the encapsulant

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The preparation method of the anti-vulcanization patch LED encapsulation glue of the present invention, comprises the steps:

[0018] S1, prepare the initial base vinyl silicone resin

[0019] Add 90 grams of deionized water, 3 grams of trifluoromethanesulfonic acid, 60 grams of xylene, and 25 grams of vinyl double-capped heads into the four-necked flask in sequence, and cool the above materials to below 20°C in an ice-water bath, and then slowly put the A mixture of 250 grams of phenyltrimethoxysilane and diphenyldimethoxysilane was added dropwise into the four-necked flask, and then heated to 70°C for 3 hours of reaction. After the reaction was completed, it was poured into a separatory funnel for phase separation , to obtain the initial base vinyl silicone resin.

[0020] S2, preparation of purified base vinyl silicone resin

[0021] Add 1.3 grams of superfine white carbon powder and 16 grams of silazane to the initial vinyl silicone resin obtained in step S1, stir...

Embodiment 2

[0025] The preparation method of the anti-vulcanization patch LED encapsulation glue of the present invention, comprises the steps:

[0026] S1, prepare the initial base vinyl silicone resin

[0027] Add 110 grams of deionized water, 10 grams of concentrated sulfuric acid with a mass fraction of 98%, 150 grams of cyclohexane, and 80 grams of vinyl double-capped heads into a four-necked flask in sequence, and cool the above materials to below 20°C in an ice-water bath , and then slowly drop 350 grams of phenyltrimethoxysilane and diphenyldimethoxysilane mixture into the four-necked flask, then raise the temperature to 80°C for 3 hours, and pour into the liquid separation after the reaction is completed. The phases were separated in a funnel to obtain the initial base vinyl silicone resin.

[0028] S2, preparation of purified base vinyl silicone resin

[0029] Add 1.3 grams of superfine white carbon powder and 16 grams of silazane to the initial vinyl silicone resin obtained i...

Embodiment 3

[0033] The preparation method of the anti-vulcanization patch LED encapsulation glue of the present invention, comprises the steps:

[0034] S1, prepare the initial base vinyl silicone resin

[0035] Add 100 grams of deionized water, 5 grams of trifluoromethanesulfonic acid, 80 grams of xylene, and 50 grams of vinyl double-capped heads into the four-necked flask in sequence, and cool the above materials to below 20°C in an ice-water bath, and then slowly put the Add the mixture of 200 grams of phenyltrimethoxysilane and diphenyldimethoxysilane dropwise into the four-neck flask, then raise the temperature to 75°C for 3 hours, and pour it into a separatory funnel for phase separation after the reaction is completed , to obtain the initial base vinyl silicone resin.

[0036] S2, preparation of purified base vinyl silicone resin

[0037] Add 1.5 grams of superfine white carbon powder and 15 grams of silazane to the initial vinyl silicone resin obtained in step S1, stir and raise...

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Abstract

The invention provides a preparation method of anti-sulfur chip LED (Light Emitting Diode) packaging adhesive. The preparation method at least comprises the steps of adding white carbon powder and silazane into initial phenyl vinyl silicone resin to perform stirring and hyperthermic treatment. The LED packaging adhesive prepared by the preparation method of the anti-sulfur chip LED packaging adhesive has a certain function of adsorbing and removing oxidizing substances, and the gas tightness of the packaging adhesive can be effectively improved, andthus a function of delaying vulcanization can be well realized.

Description

technical field [0001] The invention belongs to the technical field of LED encapsulation glue, and in particular relates to a preparation method of an anti-vulcanization chip LED encapsulation glue. Background technique [0002] SMD LED packaging glue is widely used in the surface packaging of LED soft light strips, the special packaging of hard light strips, piranha lights, Great Wall lights and other lighting lamps, to protect the waterproof and insulating protection of electronic components, and to protect the coated circuit boards. Moisture-proof effect. [0003] At present, the SMD LED encapsulation adhesive generally has the disadvantage of poor vulcanization resistance, which is related to the air permeability and oxygen permeability of the encapsulation adhesive. Due to the poor air tightness of the encapsulation adhesive, some oxidizing substances from the outside world can penetrate into the encapsulation adhesive. , to react with the silver-plated layer at the bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J183/04C09J11/04
CPCC08L2201/08C08L2205/025C08L2205/03C09J11/04C09J183/04C08L83/04C08K3/36
Inventor 陈永林
Owner GUANGDONG JIEGUO NEW MATERIAL CO LTD
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