Nickel-gold plating circuit board production technology

Abstract

The invention discloses a circuit board production technology, and especially relates to a nickel-gold plating circuit board production technology. The nickel-gold plating circuit board production technology is characterized in that step 1, an appearance of a circuit board can be produced; step 2, the hollowing-out of the circuit board can be carried out by the punching; step 3, the surface processing of the circuit board can be carried out after the stamping; step 4, the processing before the Electroless Nickel / Immersion Gold processing of the stamped circuit board can be carried out; and step 5, the Electroless Nickel / Immersion Gold processing can be carried out. The nickel-gold plating circuit board production technology is advantageous in that the common operation process adopted by convention circuit board production, and the stamping is preposed, and the two times of the circuit board surface processing can be combined, and then the loss of the opened liquid medicine can be reduced; compared to the prior art, the costs can be reduced by about 20%, and the success rate of one-time production can be increased by 15%, and therefore the production efficiency can be improved, the total production period can be reduced, and the economic benefit is obvious.

Description

technical field [0001] The invention relates to a production process of a circuit board, in particular to a production process of a nickel-plated gold circuit board. Background technique [0002] In the circuit board production process, the conventional method is to adopt the following mode: circuit board appearance production --- circuit board appearance surface post-treatment --- punch hollowing --- nickel-gold pre-treatment --- nickel-gold treatment, no need In the case of gold plating, the cost difference of this process is not large, but when gold plating is required, it is necessary to process a large area of ​​copper surface. The production cost is high, the production efficiency is low, and the quality of the circuit board product cannot be guaranteed. . Contents of the invention [0003] The purpose of the present invention is to overcome the above problems existing in the prior art, and to provide a nickel-plated gold circuit board production process. The presen...

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Problems solved by technology

[0002] In the circuit board production process, the conventional method is to adopt the following mode: circuit board appearance production --- circuit board appearance surface post-treatment --- punch hollowing --- nickel-gold pre-treatment --- nickel-gold treatment, no need In the case of gold plating, the cost difference of this process is not large, but when gold plating is required, it is necessary to process a large area of ​​copper surface. The production cost is high, the production efficiency is low, and the quality of the circuit board product cannot be guaranteed.

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