Mobile terminal

A technology for mobile terminals and motherboards, applied in cooling/ventilation/heating transformation, etc., can solve problems such as reducing the performance of mobile phones, affecting user experience, etc., to achieve the effect of improving heat dissipation effect, improving user experience, and simplifying terminal structure

Active Publication Date: 2016-05-11
YULONG COMPUTER TELECOMM SCI (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this technical solution, the improvement of the use of heat dissipation film materials will generally be 3-8°C, and the temperature reduction is limited. More improvements need to be realized by software cooling management measures such as CPU frequency reduction or charging current limit, but these measures will reduce the temperature of the mobile phone. performance, affecting user experience

Method used

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0026] see figure 1 and figure 2 , is a mobile terminal provided in the first embodiment of the present invention, including a housing 1, a middle frame bracket 2, and a main board 3 provided with electronic components 4; Fixed connection.

[0027] The middle frame bracket 2 can provide structural support and fixation for the main board 3 and other components on the terminal, facilitating the assembly and connection of various components in the terminal. The electronic component 4 is a component on the motherboard 3 that generates heat, such as a CPU or the like. There may be one electronic component 4, or there may be a plurality of them.

[0028] The middle frame bracket 2 includes a first board 21 and a second board arranged in layers. Both the first plate 21 and the ...

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Abstract

The invention discloses a mobile terminal comprising a shell, an intermediate frame support and a mainboard which is provided with electronic components. The intermediate frame support comprises a first board and a second board which are arranged in a lamination way. The first board and the second board are metal boards, and the peripheral edges of the first board and the second board are fixedly connected and a vacuum cavity is formed between the first board and the second board. Two-phase fluid is arranged in the vacuum cavity. The internal wall of the vacuum cavity is provided with capillary structures. The mainboard is connected with the first board so as to transfer heat generated by the electronic components to the first board. Gasification and liquefaction of two-phase fluid are cyclically performed in the vacuum cavity so that heat can be transferred to the position of the intermediate frame support with lower temperature and thus heat radiation can be realized. Two effects of structural supporting and heat radiation can be realized by one intermediate frame support so that the terminal structure is simplified. Besides, heat generation is solved by relying on a hardware heat radiation scheme completely, temperature is controlled within the acceptable range of users, and frequency and the size of charging current of the electronic components are controlled without software so that performance of the terminal is enabled to be fully exerted.

Description

technical field [0001] The present invention relates to electronic products, in particular to a mobile terminal. Background technique [0002] With the development of smart phones, the CPU single-core and dual-core have been upgraded to quad-core and octa-core, and the frequency is getting higher and higher. The excessive heat generation of mobile terminals has become an experience bottleneck. The current solution is to use natural and artificial graphite film to attach Enhance the heat dissipation performance on the inside of the back cover of the mobile phone, reduce the surface temperature of the fuselage, and improve the thermal experience. However, in this technical solution, the improvement of the use of heat dissipation film materials will generally be 3-8°C, and the temperature reduction is limited. More improvements need to be realized by software cooling management measures such as CPU frequency reduction or charging current limit, but these measures will reduce th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20
Inventor 伏坚
Owner YULONG COMPUTER TELECOMM SCI (SHENZHEN) CO LTD
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