LED Light Bar, Planar Light Source Including The Same, And Method For Manufacturing The Planar Light Source

Abstract

The invention provides a LED light bar, a planar light source including the same, and a method for manufacturing the planar light source. The light-emitting diode light bar comprises a light bar substrate, at least one bonding layer, at least one LED chip, at least one first wire, at least one second wire and at least one package unit. The light bar substrate defines a receiving space and comprises an intermediate metal plate, a first side metal plate and a second side metal plate, which are insulated from each other. The at least one LED chip is bonded to a light-reflecting surface of the intermediate metal plate by the at least one bonding layer. The at least one first wire and the at least one second wire are coupled between positive and negative terminals of the at least one LED chip and the first side metal plate and the second side metal plate, respectively. The at least one package unit packages the at least one LED chip.

Description

technical field [0001] The invention relates to a light emitting diode light bar, a planar light source device and a manufacturing method thereof, in particular to a light emitting diode light bar, a planar light source device and a manufacturing method thereof which simplify the process and improve luminous efficiency. Background technique [0002] Light Emitting Diode (LED) has gradually replaced traditional lighting fixtures such as incandescent bulbs and halogen lamps due to its fast response, small size, low power consumption, low heat, and long service life. [0003] Figure 1A is a schematic diagram of a known backlight structure; Figure 1B then Figure 1A An exploded view of the backlight structure shown. Such as Figure 1A and Figure 1B As shown, the backlight structure includes a light guide plate 10, a light emitting module 20, a reflector 30 having a first reflective portion 31 and a second reflective portion 32, and a reflector having opposite first surfaces...

AI Technical Summary

Problems solved by technology

Due to the large difference in refractive index between chips, devices, and packaging materials; and the light guide plate 10, the light output of the light emitting diode device after packaging is too small due to the small total reflection angle, which reduces the light extraction efficiency.

In addition, in the backlight module, the light from the chips (chips) passes through the encapsulant body 800, enters the air, and then enters the light guide plate 10. Since the light must pass through multiple interfaces of different media, resulting in the loss of light energy. Large loss

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