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A multi-circuit finned surface cooler

A surface cooler and fin-type technology, applied in the field of multi-circuit fin-type surface coolers, can solve the problem of inability to meet the high-throughput heat dissipation requirements of supercomputers, insufficient combination of fins and pipes, passage area and heat dissipation. Problems such as small exchange area, to avoid the possibility of being sucked into the computer, improve heat transfer efficiency, and reduce energy consumption

Active Publication Date: 2018-02-23
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing surface coolers used in supercomputer water-cooled cabinets have fewer fin rows, small passage area and heat exchange area, poor thermal conductivity of materials, and insufficient combination of fins and pipelines, resulting in low heat exchange efficiency and waste energy, unable to meet the high-throughput heat dissipation requirements of supercomputers

Method used

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  • A multi-circuit finned surface cooler
  • A multi-circuit finned surface cooler

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Experimental program
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Embodiment 1

[0033] This embodiment is a preferred design scheme of the surface cooler of the present invention:

[0034] 1. Cooling fins:

[0035] The cooling fins are thin copper sheets, the length of which is slightly smaller than the width of the shell, and the width is determined according to the number of fin rows. For example, if four rows of fins are installed, the width of the fins should be less than 1 / 4 of the shell length. Fin thickness is sub-millimeter. Make 2 rows of 4 holes in one set of sheets. Thread the copper pipe into the hole. The copper tube adopts methods such as stretching to increase the outer diameter, so that the copper tube and the fins are tightly combined to ensure heat transfer efficiency. The number and length of the pipes also determine the heat transfer area, and as many pipes as possible should be passed and rotated to make the pipes form a U-shape with high density. In the present invention, 8 holes are opened in each set of fins in combination wit...

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Abstract

The invention discloses a multi-circuit finned surface cooler, which belongs to the technical field of heat exchange devices. The surface cooler adopts the method of connecting eight circulating heat exchange copper tubes in parallel between the main water inlet and outlet pipes, and firmly socketing copper heat dissipation fins on every two heat exchange tubes. A total of four rows of heat dissipation fins are connected in series. The heat exchange area is enlarged within the limited size, and the utilization rate of the cooling water is increased, so the heat exchange efficiency is increased, and the temperature difference of the circulating air is increased. Guarantee the cooling requirements of the supercomputer and provide a reliable environment for the stable work of the computer. The invention can be used in the field of general heat exchange, such as heat exchangers for water-cooled cabinets of supercomputers.

Description

technical field [0001] The invention relates to the technical field of heat exchange devices, in particular to a multi-circuit finned surface cooler, which is used in a high-performance cluster water-cooled cabinet circulating water system. Background technique [0002] The traditional computer room uses the downflow channel constructed by precision air conditioners to provide cooling for the equipment, and the heat dissipation of the equipment is discharged into the environment of the computer room, and then recycled by the air conditioner. This heat cycle method is aimed at cooling the overall space of the computer room, which has a huge heat load and huge power consumption. With the construction of a new generation of supercomputing centers, basic equipment such as computers, networks, services, and storage are further concentrated, and large-scale computing and large-capacity storage equipment continue to increase in speed and processing power, but also bring about a sha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28B1/02
Inventor 滕春禹徐东生杨锐
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI