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Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors

A technology of semiconductors and devices, applied in the field of packaging of semiconductor devices, can solve problems such as the inability to use MEMS pressure sensors

Active Publication Date: 2016-06-01
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Therefore, pre-molded or post-molded standard QFN packages cannot be used for MEMS pressure sensors intended for automotive applications
[0008] On the other hand, the use of low modulus substrate LGA is not possible due to the risk of substrate warping and poor ultrasonic transmission during ultrasonic wire bonding

Method used

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  • Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors
  • Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors
  • Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors

Examples

Experimental program
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Embodiment Construction

[0022] figure 1 A support frame 1 for a QFN (Quad Flat No-leads) package is shown comprising a die pad 2 attached on an adhesive tape 4 and a plurality of terminals 3 . The support frame 1 is a lead frame and may be made of any suitable material such as copper, aluminum and the like. In this embodiment, the die pad 2 is not plated on the bottom, while the terminals 3 are plated on the bottom and sides. For example, the terminals 3 may be Ni, Pd, Au or similar plated in a manner known per se for QFN packages. The adhesive strip 4 may be a thermoplastic standard adhesive strip attached to the rear side of the support frame 1 .

[0023] then, figure 2 , attach the first adhesive film 5 to the front surface of the die pad 2 and place the first die 6 on the first adhesive film 5 . The first die 6 is larger than the die pad 2 . The first adhesive layer 5 may be DAF (Die Attach Film) currently used in the semiconductor industry; known epoxy resins. The first adhesive film 5 ...

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Abstract

The invention relates to package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors. A surface mounting device (50) has one body (6) of semiconductor material such as an ASIC, and a package surrounding the body. The package has a base region (15) carrying the body, a cap (20) and contact terminals (3). The base region (15) has a Young's modulus lower than 5 MPa. For forming the device, the body (6) is attached to a supporting frame (1) including contact terminals (3) and a die pad (2), separated by cavities; bonding wires (14) are soldered to the body (6) and to the contact terminals (3); an elastic material is molded so as to surround at least in part lateral sides of the body (6), fill the cavities of the supporting frame (1) and cover the ends of the bonding wires (14) on the contact terminals; and a cap (20) is fixed to the base region (15). The die pad (2) is then etched away.

Description

technical field [0001] The present invention relates to packaging for semiconductor devices sensitive to mechanical and thermomechanical stress, such as MEMS pressure sensors. Background technique [0002] As is known, semiconductor devices such as integrated circuits and MEMS devices are often enclosed in packages for their protection and handling. In the following, reference is made to packages that allow surface mounting. [0003] Currently, the most common type of surface mount package for MEMS sensors is the so-called LGA (Land Grid Array) package, which has a square grid of contacts on the underside of the package. [0004] However, standard LGA packages for MEMS pressure sensors do not meet automotive requirements where solder inspection of printed circuit boards is provided. Therefore, so-called Quad Flat No-Lead Single-Row (QFN-Sr), also known as Micro-Lead Frame (MLF) and SON (Small Outline No-Lead) packages are used, ie allow surface mounting and have one periph...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81C1/00
CPCB81C1/00325H01L2224/48091H01L2224/73265H01L2224/8592H01L23/49575H01L23/49861H01L23/057H01L21/50B81B7/0048B81B7/0058B81C1/0023B81B2201/0264B81B2207/092B81B2207/096B81B2207/097B81C2203/0109H01L2924/00014B81B7/0045G01L19/148
Inventor F·V·丰塔纳J·塔利多
Owner STMICROELECTRONICS SRL
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