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Mobile terminal, flexible circuit board and manufacturing method thereof

A technology of a flexible circuit board and a manufacturing method, applied in the electronic field, can solve the problems of the influence of FPC flexibility and increase in thickness, and achieve the effects of good signal transmission quality, reduced thickness, and improved flexibility

Active Publication Date: 2018-01-23
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since FPC needs to have better flexibility, increasing the number of layers of FPC to increase its thickness will undoubtedly affect the flexibility of FPC.

Method used

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  • Mobile terminal, flexible circuit board and manufacturing method thereof
  • Mobile terminal, flexible circuit board and manufacturing method thereof
  • Mobile terminal, flexible circuit board and manufacturing method thereof

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Embodiment Construction

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0036] For ease of description, spatially relative terms such as "under", "beneath", "below", "above", "on" and other spatially relative terms may be used herein to describe an element as shown in the drawings Or the relationship of a feature to another element or feature(s). It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, directly on, or directly...

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PUM

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Abstract

The invention provides a flexible printed circuit board. The flexible printed circuit board comprises a dielectric layer, a conductive layer, a shielding film layer and a covering film layer, which are successively laminated. The dielectric layer comprises a first wiring region, a second wiring region and a third wiring region, which are successively connected. The conductive layer comprises multiple conductive circuits and multiple grounding regions. The conductive circuits are arranged in the second wiring region. Two ends of each of the conductive circuits are connected with the first wiring region and the third wiring region, so signal transmission paths are formed. The grounding regions provide grounding signals for the conductive circuits. The covering film layer comprises multiple openings which correspond to the grounding regions. The shielding film layer is connected with the grounding regions via the openings, so a grounding path between the first wiring region and the third wiring region is formed. In addition, the invention also provides a mobile terminal and a manufacturing method of the flexible printed circuit board. The flexible printed circuit board has quite high flexibility.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a mobile terminal, a flexible circuit board and a manufacturing method thereof. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit, FPC) is a printed circuit board made of flexible insulating substrates, which has many advantages that rigid printed circuit boards (Printed Circuit board, PCB) do not have, such as FPC can be bent freely, roll Winding and folding can be arranged arbitrarily according to the requirements of space layout, so as to achieve the integration of component assembly and wire connection. Due to the above advantages, the use of FPC can effectively reduce the volume of electronic products, increase the flexibility of circuit layout, and meet the needs of electronic products in the direction of high density, miniaturization, and high reliability. At present, FPC has been widely used in aerospace, military, mobile communic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/00
CPCH05K1/0225H05K1/118H05K3/0011H05K2201/096
Inventor 陈艳
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD