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Cooling device of electron beam selective melting forming equipment

A technology of selective melting and cooling device, applied in the field of additive manufacturing, can solve the problem of slow cooling rate of powder pile cooling of formed parts, and achieve the effects of increasing cooling contact area, good use effect and shortening cooling time

Active Publication Date: 2016-06-08
西安赛隆增材技术股份有限公司
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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a cooling device for electron beam selective melting forming equipment, which has a simple structure, reasonable design, reliable working performance, fast cooling rate, and good use effect. Effectively solve the problem of slow cooling rate of formed parts powder pile

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  • Cooling device of electron beam selective melting forming equipment
  • Cooling device of electron beam selective melting forming equipment
  • Cooling device of electron beam selective melting forming equipment

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Embodiment Construction

[0048] like figure 1 , Figure 9 As shown, the present invention includes a circulating air cooling device for cooling the electron beam selective melting forming chamber (that is, inside the electron beam selective melting forming chamber) and a control device 1 for controlling the circulating air cooling device. The melting and forming chamber includes a forming chamber bottom wall 2-1, a forming chamber 2-2 installed on the forming chamber bottom wall 2-1, and a body that is installed in the forming chamber 2-2 and can move up and down in the forming chamber 2-2. The forming base plate 2-3 and the lifting mechanism that drives the forming base plate 2-3 to move up and down, the forming bin 2-2 is arranged vertically, and the forming base plate 2-3 is arranged horizontally and installed on the lifting mechanism ; The forming bottom plate 2-3 is rectangular, and the forming chamber 2-2 is in the shape of a quadrangular column and is formed by splicing four side plates respec...

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Abstract

The invention discloses a cooling device of electron beam selective melting forming equipment. The cooling device comprises a circulating air cooling device for cooling an electron beam selective melting forming chamber and a control device for controlling the circulating air cooling device, wherein the electron beam selective melting forming chamber comprises a forming chamber bottom wall, a forming cabin, a forming bottom plate and a lifting mechanism; the circulating air cooling device comprises a cooling air supplying device, a cooling block, two cooling side plates and a height detection unit; the cooling block is horizontally arranged above the forming chamber bottom wall and located in the forming cabin, and two cooling side plates are two side plates in the forming cabin; an in-plate cooling air runner is arranged in the cooling side plate, and an air inlet side cooling air runner, an air outlet side cooling air runner and an inter-side plate cooling air runner are arranged in the cooling block. The cooling device disclosed by the invention is simple in structure, reasonable in design, reliable in working performance, fast in cooling rate, good in use effect and capable of effectively solving the problem that the formed parts are low in powder pile cooling rate.

Description

technical field [0001] The invention belongs to the technical field of additive manufacturing, and in particular relates to a cooling device for electron beam selective melting forming equipment. Background technique [0002] Using powder as raw material, the additive manufacturing technology of parts through selective deposition, selective sintering or selective melting process is currently a hot spot in the field of rapid manufacturing. Typical technologies include: selective laser sintering (Selective Laser Sintering, SLS), selective laser melting (Selective Laser Melting , SLM), electron beam melting (Electron Beammelting, EBM), three-dimensional printing (ThreeDimensionalPrinting, 3DP), etc. The process flow of the above technologies is similar, and the specific process is as follows: firstly, a layer of raw material powder is laid on the processing plane, and then the processing source selects the powder according to the cross-sectional shape of the part to form the cr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/105B33Y30/00
CPCB33Y30/00B22F10/00B22F12/33B22F12/90B22F12/70B22F12/20B22F10/28Y02P10/25
Inventor 赵培贾文鹏朱纪磊周勃延全俊涛
Owner 西安赛隆增材技术股份有限公司
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