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Water-based diamond sand wire silicon ingot squaring liquid and application thereof

A technology for emery wire and silicon ingot, which is applied in the field of prescribing solution for silicon ingot cutting by emery wire, can solve the problems of limited diamond wire tension, increased loss, unfavorable raw material saving, etc., and achieves the effect of avoiding loss and excellent lubrication

Active Publication Date: 2016-06-15
CHANGZHOU GREATOP NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the diameters of the diamond wires (also known as "diamond wires") used in the squaring of silicon ingots and subsequent cutting into slices are different. This is because silicon wafer products are relatively thin and difficult to cut. The tension required by the diamond wire is limited, generally in the range of 14-16N, so choose a diamond wire with a diameter of 80um-100um. In the process of cutting silicon ingots into square silicon rods, the tension requirements for diamond wires are very high, generally reaching 85-95N. Therefore, the diameter of diamond wires used needs to reach 420um. If the diameter of the cutting wire is too small, it will cause During the cutting process, it cannot withstand the tension and breaks, and the loss of silicon material is directly related to the thickness of the cutting wire. The increase in the diameter of the diamond wire will inevitably lead to increased loss, which is not conducive to the saving of raw materials

Method used

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  • Water-based diamond sand wire silicon ingot squaring liquid and application thereof
  • Water-based diamond sand wire silicon ingot squaring liquid and application thereof
  • Water-based diamond sand wire silicon ingot squaring liquid and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0018] A prescription solution for diamond wire cutting silicon ingots, comprising the following components in parts by weight:

[0019]

[0020] At the same time, the content ranges of sodium hydroxide and sodium acetate trihydrate in the prescription solution are 24g / L and 28g / L respectively.

[0021] The preparation method is as shown in the instructions;

[0022] After diluting 300 times with the prescribing solution in this embodiment, the silicon ingot was squared and cut at room temperature. The diameter of the diamond wire used for the square was 120um. After the cutting was successfully completed, the diamond wire did not break or relax.

Embodiment 2

[0024] A prescription solution for diamond wire cutting silicon ingots, comprising the following components in parts by weight:

[0025]

[0026]

[0027] At the same time, the content ranges of sodium hydroxide and disodium hydrogen phosphate dodecahydrate in the prescribing solution are 25g / L and 30g / L respectively.

[0028] The preparation method is as shown in the instructions;

[0029] After diluting 300 times with the prescribing solution in this embodiment, the silicon ingot was squared and cut at room temperature. The diameter of the diamond wire used for the square was 100um. After the cutting was successfully completed, the diamond wire did not break or relax.

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Abstract

The invention belongs to the technical field of silicon crystal cutting, and particularly relates to squaring liquid for silicon ingot cutting by a diamond sand wire and application of the squaring liquid. At the normal temperature, alkali and heat storage materials are added into deionized water and are evenly stirred; and then, an extreme pressure agent, a surface active agent and an ester oiliness agent are added, and are evenly stirred, and the squaring liquid for silicon ingot cutting by the diamond sand wire is obtained. On the basis of obtaining excellent lubricating, cooling, corrosion prevention, rust prevention and extreme pressure resistance functions, squaring cutting of the small-diameter diamond sand wire to silicon ingots can be achieved, and losses of the silicon ingots in the squaring technology are avoided.

Description

technical field [0001] The invention belongs to the technical field of silicon crystal cutting, and in particular relates to a prescription solution for silicon ingot wire-cutting with silicon carbide and an application thereof. Background technique [0002] At present, the process of squaring silicon ingots and cutting silicon wafers mainly adopts free mortar cutting suspension and diamond sand wire cutting, while diamond sand wire cutting is a newer cutting process. The friction of silicon material is used for cutting, the cutting fluid no longer needs to suspend silicon carbide particles, and it no longer needs to have a high viscosity, and it does not need to mix silicon carbide blades in the solution. Its cutting speed is the same as that of steel wire in mortar cutting process. 2 to 3 times that of the mortar cutting technology, and its consumption of water and electricity is reduced by two-thirds compared with the mortar cutting technology. The silicon powder produced...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04C10M173/02
CPCB28D5/045C10M173/02
Inventor 张小飞
Owner CHANGZHOU GREATOP NEW MATERIAL CO LTD