Environment-friendly plate prepared from UF-emulsible MDI

Abstract

The invention discloses an environment-friendly plate prepared from UF-emulsible MDI. The plate is prepared from, by weight, 70-95 parts of circuit board powder, 10-20 parts of the UF-emulsible MDI, 3-15 parts of a catalyst and 1-7 parts of chemical fiber. A preparing method includes the steps that the circuit board powder is dried and stirred, the catalyst and the chemical fiber are added, a double-shaft agravic efficient mixer is used for turnover and mixing, then UF-emulsible MDI is sprayed on the mixture, the mixed mixture is put into a mold flat plate and is heated and pressurized to obtain the plate. The environmental-friendly plate has the advantages that the circuit board powder is used as the raw material of the environmental-friendly plate, waste circuit boards are recycled and reused, environment pollution is avoided, no irritant formaldehyde is separated out of the prepared environment-friendly plate, environment pollution is reduced, the pressurizing time during manufacturing is short, production efficiency is effectively improved, the requirement for the water content of the circuit board powder is low, energy can be saved, and the plate is good in water resistance, high in strength and low in density and meets the idea of an environment-friendly building material.

Description

technical field [0001] The invention relates to an artificial board, in particular to an environment-friendly board prepared by utilizing UF-emulsifiable MDI. Background technique [0002] With the rapid development of science and technology and the updating of electronic products, the number of waste electronic products has increased sharply, which has brought great harm to human health and environmental pollution. The recycling and reuse of waste circuit boards has become the focus of social attention. Therefore There is an urgent need to develop an environmentally friendly product made from circuit board powder. [0003] UF urea-formaldehyde resin is formed by polycondensation of urea and formaldehyde under the action of a catalyst (alkaline or acidic catalyst) into an initial urea-formaldehyde resin, and then under the action of a curing agent or an auxiliary agent to form an insoluble and infusible final resin. Urea-formaldehyde resin glue has the advantages of high bo...

AI Technical Summary

Problems solved by technology

[0004] Emulsifiable MDI includes MDI (4,4'-diphenylmethane-diisocyanate) and polymeric MDI (polymethylene-polyphenyl-polyisocyanate), in which polymeric MDI is highly hydrophobic and difficult to miscible with water And to form a stable emulsion, because the NCO group in the MDI molecule is easy to react with water to produce ureido compounds, even if the emulsion is formed, there is a problem of pot life