Method for calculating alloy droplet deposition cooling rate

A technology of cooling rate and calculation method, applied in the field of 3D printing process, can solve problems such as cost increase, achieve the effect of saving materials, optimizing 3D printing process and parameters, and increasing the degree of controllability

Inactive Publication Date: 2016-06-22
SOUTHWEST JIAOTONG UNIV
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AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for calculating the cooling rate of alloy droplet deposition, which can effectively solve the prediction ...

Method used

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  • Method for calculating alloy droplet deposition cooling rate
  • Method for calculating alloy droplet deposition cooling rate
  • Method for calculating alloy droplet deposition cooling rate

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Embodiment 1

[0027] Step 1. Select CuSn6 alloy as the experimental material. Based on the uniform droplet 3D printing process and material parameters, adjust the process parameters and injection conditions to prepare alloy droplets with different particle sizes and uniform distribution. The alloy droplets are ejected and pass through the movement path Natural cooling, each alloy droplet cools naturally and solidifies into tiny particles, which are collected for metallographic sample preparation.

[0028] Step 2. Carry out sample inlay on CuSn6 alloy particles with different particle sizes in turn, use ethanol + hydrogen peroxide as the corrosion solution to corrode, use an optical microscope to observe the dendrite structure, and measure n≧40 groups twice for any droplet size Dendrite spacing, and measure the total length l, according to the relationship between the secondary dendrite spacing Calculate the secondary dendrite spacing value of the alloy droplet corresponding to the particle...

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Abstract

The invention discloses a method for calculating the alloy droplet deposition cooling rate and belongs to the technical field of 3D printing technologies. According to the method for calculating the alloy droplet deposition cooling rate, on the basis of a thermodynamic equation, a mathematic model of the cooling rate and the dendritic structure character is built, and accordingly the cooling rate is calculated according to droplet structure evolution. In the solidification process, the influence of crystalline latent heat is taken into account, the droplet ejecting speed is combined, the heat exchanging condition of the droplet movement process and the external environment is considered, and the variable relationship of the cooling rate of droplets with different diameters is calculated. According to the dendrite spacing dimension, a semi-empirical formula of the cooling rate and the secondary dendrite spacing is built and derived through regression analysis; by observing and measuring the dendritic structure of the deposition droplets, the cooling rate of the deposition droplets in the 3D printing process is obtained. According to the calculation method, the relationship between the 3D printing material structure and the cooling rate can be built, and deposition droplet solidification structure evolution of 3D printing can be effectively predicted, adjusted and controlled. The method for calculating the alloy droplet deposition cooling rate is mainly used for 3D printing technology control.

Description

technical field [0001] The invention relates to the technical field of 3D printing technology. Background technique [0002] Uniform droplet 3D printing technology is an additive manufacturing technology proposed and developed by Orme in the United States in 1993. It is based on the "discrete-superposition" forming principle, which produces uniform metal droplets through the droplet ejector, and at the same time controls the movement of the three-dimensional substrate, so that the metal droplets are precisely deposited at a specific position and fused with each other, solidified, point by layer \ accumulation , so as to realize the rapid printing of complex 3D structures. This technology has the advantages of a wide range of spraying materials, unconstrained free forming, and no need for expensive special equipment. It has broad application prospects in the fields of preparation of tiny and complex metal parts, circuit printing and electronic packaging, and structural and f...

Claims

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Application Information

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IPC IPC(8): B22F3/115B33Y50/00
CPCB22F3/115B33Y50/00
Inventor 徐轶陈亚
Owner SOUTHWEST JIAOTONG UNIV
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