Method for preparing flexible display

Abstract

The invention discloses a method for preparing a flexible display, comprising the following steps: providing a glass substrate which consists of a first side and a second side opposite to the first side, and forming a flexible display panel on the first side; forming polygonal glass columns on the second side through cutting at intervals; pushing the polygonal glass columns out of the first side on the second side; and lifting off the flexible display panel from the polygonal glass columns to form the flexible display. According to the invention, the flexible display part is lifted off from the glass substrate through the polygonal glass columns formed on the glass substrate, and the flexible display is then lifted off from the polygonal glass columns, so that the flexible display can be well lifted off from the glass substrate. The lift-off method is simple to operate and low in cost, has no adverse effects on light-emitting devices, and can improve the yield of flexible display lift-off.

Description

technical field [0001] The invention relates to the field of OLED display technology, in particular to a method for preparing a flexible display. Background technique [0002] In recent years, the display market has changed rapidly, and the central position has been occupied by flat panel display devices, and the flat panel display devices are devoted to manufacturing large-sized, thin and light display devices. Such display devices include liquid crystal display devices, plasma display panels, organic electroluminescence displays, and the like. However, the existing liquid crystal display devices, plasma display panels, and organic electroluminescent displays are all made of glass substrates, which limit their application range due to their inflexibility. [0003] In the preparation process of flexible substrates, a PI (Polyimide, polyimide) film coating method is generally used at present to manufacture flexible displays capable of bending and folding displays. The steps...

AI Technical Summary

Problems solved by technology

However, the peeling technology of the flexible display and the glass substrate has not achieved good results, and it is easy to cause great damage to the PI film.

[0004] In the prior art, there are roughly the following methods for peeling off flexible displays on substrates: use laser lift-off technology (Electronics on Plastic by Laser Release), but laser lift-off technology requires high laser energy and high cost. Energy can easily cause damage to light-emitting devices

Or use the resistance heating induced liftoff technology (Joule heating induced liftoff), which uses heating to separate the flexible display from the glass substrate. However, the temperature of the resistance heating induced lift off technology is too high during the peeling process, and the light emitting device needs to be protected at the same time. increase manufacturing costs

Or use the peeling method of the stainless steel substrate (Stainless steel substrate). This peeling method is peeled off by chemical method. Due to the corrosiveness, acidity and alkalinity of chemicals, the life of the flexible display will be greatly reduced.

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