A kind of micro-led chip preparation and substrate peeling method

A chip and substrate technology, applied in the field of Micro-LED chip preparation and substrate stripping, can solve the problems of damage to the LED active layer, failure to effectively melt the GaN buffer layer, and stripping failure, etc., to achieve convenient interconnection and stripping yield High, simple installation effect

Active Publication Date: 2022-07-29
NANJING RGB INFORMATION TECH CO LTD
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Problems solved by technology

At the same time, the laser energy needs to be precisely regulated to reach the GaN buffer layer. If the energy is too high, it will damage the active layer of the LED. If the energy is too small, it may not be able to effectively melt the GaN buffer layer and cause peeling failure.

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  • A kind of micro-led chip preparation and substrate peeling method
  • A kind of micro-led chip preparation and substrate peeling method

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Embodiment Construction

[0027] The present invention will be further clarified below in conjunction with the specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and not to limit the scope of the present invention. The modifications all fall within the scope defined by the appended claims of this application.

[0028] It should be noted that like numerals and letters refer to like items in the following figures, so once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

[0029] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "peripheral surface", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or is the customary pendulum when the product of the invention is used. The orientation or positional relationship is only for the convenie...

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Abstract

The invention discloses a method for preparing a Micro-LED chip and peeling off a substrate in the field of optoelectronic devices. The Micro-LED chip preparation and substrate peeling method includes the following steps: step 1, uniformly coating UV glue on a transparent substrate; step 2, growing Al on the transparent substrate coated with UV glue 2 O 3 Thin film and LED thin film structure; step three, in Al 2 O 3 A discrete Micro-LED structure is formed on the thin film and the LED thin film structure; step 4, irradiating the back of the transparent substrate with an ultraviolet surface light source, the transparent substrate and the Al 2 O 3 The UV glue between the films is desensitized and loses its viscosity, so as to achieve the purpose of separating the Micro-LED structure from the transparent substrate, forming a Micro-LED chip. The invention can quickly realize the peeling of the Micro-LED chip substrate, has high work efficiency, low cost and high yield.

Description

technical field [0001] The invention relates to the technical field of optoelectronic devices, in particular to a Micro-LED chip preparation and substrate peeling method. Background technique [0002] With the continuous progress of LED in chip manufacturing, integrated packaging, display control and process technology, LED is not only widely used in the field of semiconductor lighting, but also gradually penetrates into the field of LED display. LED small-pitch display (Mini-LED) and micro-pitch display (Micro-LED) will be widely used in high-definition TV, high-definition TV, Wearable electronics, VR, AR and other fields are expected to become strong competitors of LCD and OLED in the future, ushering in explosive growth. [0003] LED small-pitch display (Mini-LED) and micro-pitch display (Micro-LED) require the dot pitch of LED full-color pixels to be 10-300um. Size 2um-50um. For such a small Micro-LED light-emitting chip, if the laser cutting and splitting process in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
CPCH01L33/007
Inventor 郭德博李忠
Owner NANJING RGB INFORMATION TECH CO LTD
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