Deposition assembly and semiconductor processing equipment

Abstract

The invention provides a deposition assembly and semiconductor processing equipment which are used for transferring wafers and fixing the wafers to a base. The base is lifted to a technology position or descended to a loading and unloading position by going up and down. The deposition assembly comprises a deposition ring, a clamping ring and at least three thimbles, wherein the thimbles are distributed in the circumferential direction of the base; in addition, when the base is located in the loading and unloading position, the thimbles penetrate through the deposition ring by going up and down, so that the plane where the top ends of the thimbles is higher or lower than the upper surface of the base. Moreover, a positioning convex part is arranged on the bearing surface of each thimble, and the bearing surfaces are used for supporting the wafers. The positioning convex parts are used for preventing the wafers from moving in the radial direction of the wafers when the wafers are supported by the thimbles. According to the deposition assembly provided by the invention, not only can the radial positions of the wafers on the thimbles be limited by the deposition assembly, but also the processing difficulty of the base can be reduced; and in addition, the harmful effect on the uniformity of the base cooling wafers due to the fact that a through hole is machined in the base is avoided.

Description

technical field [0001] The invention belongs to the technical field of semiconductor equipment manufacturing, and in particular relates to a deposition component and plasma processing equipment. Background technique [0002] In the manufacturing fields of integrated circuits, liquid crystal displays, thin-film solar energy, and LEDs, physical vapor deposition (Physical Vapor Deposition, hereinafter referred to as PVD) technology is usually used to deposit materials such as metal layers on wafers. During the process, it is usually necessary to set a carrier device (such as an electrostatic chuck or a mechanical chuck) in the reaction chamber to carry the wafer, and use the thimble device to transfer the wafer to the electrostatic chuck or mechanical chuck, and then the The ring holds the wafer. [0003] Figure 1A A cross-sectional view of an existing deposition assembly in process position. Figure 1B It is a cross-sectional view of the existing deposition assembly when it...

AI Technical Summary

Problems solved by technology

[0006] One, because the above-mentioned thimble 13 can only support the wafer 14, but cannot limit the position of the wafer 14 in its radial direction, this makes the wafer 14 often shift due to the movement of the thimble 13 or the interference of the vibration of the surrounding equipment, so that when After the base 10 rises and lifts up the wafer 14 on the thimble 13, the position of the wafer 14 on the base 10 will naturally deviate, which will affect the normal progress of the process.

[0007] Second, setting the through hole 101 on the base 10 for passing the thimble 13 is not only difficult to process, but also the through hole 101 will have a bad influence on the uniformity of cooling the wafer by the base 10.

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