38results about How to "Uniformity effect" patented technology

The invention relates to the technical field of processing electronic product accessories, in particular to an inkjet processing method for a glass cover plate and an inkjet device thereof. An inkjet processing method for a glass cover plate, comprising: spraying ink on the glass cover plate at least twice in the temperature range of 40-70° C., and maintaining the glass cover plate at different temperatures during each time of ink spraying to control the sprayed ink. The ink is subjected to pre-drying treatment; after the pre-drying treatment is completed, a pre-cured ink layer of predetermined thickness is formed on the glass cover plate; the glass cover plate formed with the pre-cured ink layer is subjected to baking treatment to form an ink layer, The baking temperature is 80-170°C. Before baking the ink, pre-dry the ink sprayed on the glass cover to increase the viscosity of the ink and prevent the ink from overflowing everywhere, especially the ink on the curved part of the glass cover. Flow to ensure the quality of the formed ink layer; a heating plate is installed on the inkjet device to facilitate pre-drying of the sprayed ink.

A method for preparing a low elastic modulus medical titanium alloy ingot, according to the mass percentage of each element in the TiNbTaZr alloy, calculate the weight of Ta plate, Ti plate, Zr plate and Nb plate, and each Ta plate, Ti plate, Zr plate and Nb boards are cut into slats of the same length and width; the Ta slats are placed in the middle, and the Nb slats, Zr slats and Ti slats are placed in sequence on both sides of the Ta slats; the arranged The plates are assembled and welded into consumable electrodes, and then smelted three times. The present invention utilizes the characteristic that the electric arc is maintained between the two points with the shortest distance between the two poles. During the smelting process, after the raw material with low melting point on the same cross-section is melted, the arc will be transferred to the unmelted high melting point raw material until the high melting point raw material and the When the low-melting-point raw materials are on the same plane, the arc will be transferred to the low-melting-point raw materials to continue melting, reducing the influence of different melting speeds on the uniformity of chemical composition.

The invention provides an optical method based high-speed aircraft hot surface full-field deformation measuring device. The optical method based high-speed aircraft hot surface full-field deformation measuring device comprises a double-layer quartz lamp heating array, a thin-wall high-speed aircraft shell, a square transparent window, speckle particles, a thermocouple sensor, a signal amplifier, a temperature control computer, a driving power supply, a CMOS (Complementary Metal Oxide Semiconductor) camera, a lens, a narrow-band-pass optical filter and an image processing computer. In order to solve the problem of signal blockage caused by a high temperature radiant heat source between the CMOS camera and the surface of the high-speed aircraft shell, the vertical double-layer quartz lamp heating array is designed and the square transparent window with small area is formed, so that the optical camera lens can obtain images of the hot surface of the high-speed aircraft through the transparent window. The interference light ray of the quartz lamp heating array is shielded by selecting the narrow-band-pass optical filter with specific wave length, so that speckle images with high quality and no degeneration on the hot surface of the high-speed aircraft is obtained; a digital image correlation method is utilized for analyzing the speckle images under different temperatures to realize full measurement on the displacement field and the strain field of the hot surface of the high-speed aircraft in a high temperature environment.

The invention discloses a macromolecule material crusher, the structure of which comprises a material inlet, a rotating disc, a rotating machine, a crushing device, and a support frame. The crushing device is provided with a cleaning mechanism, a movable rod, a discharge port, a crushing rod, and a mounting plate. , when the crusher is running, the natural rubber bond on the surface of the crushing rod is scraped off by the cleaning mechanism, and the force of scraping is buffered by the rubber block and the spring, and the cleaning block is scraped off by the scraping block. Clean up the knots to prevent clogging, avoid the stickiness on the surface of the broken rod to pull the natural rubber, improve the crushing rate of the natural rubber when it is crushed, prevent the sand from causing the natural rubber to stop, and avoid the unbalanced force when the natural rubber is crushed , to avoid the impact on the uniformity of natural rubber crushing, and the characteristics of bending through the bending rod after scraping, prevent the cleaning mechanism from being damaged by excessive force after scraping, and also avoid the cleaning mechanism after scraping off the adhesive Cannot pass through a curved smooth board.

The invention provides a deposition assembly and semiconductor processing equipment which are used for transferring wafers and fixing the wafers to a base. The base is lifted to a technology position or descended to a loading and unloading position by going up and down. The deposition assembly comprises a deposition ring, a clamping ring and at least three thimbles, wherein the thimbles are distributed in the circumferential direction of the base; in addition, when the base is located in the loading and unloading position, the thimbles penetrate through the deposition ring by going up and down, so that the plane where the top ends of the thimbles is higher or lower than the upper surface of the base. Moreover, a positioning convex part is arranged on the bearing surface of each thimble, and the bearing surfaces are used for supporting the wafers. The positioning convex parts are used for preventing the wafers from moving in the radial direction of the wafers when the wafers are supported by the thimbles. According to the deposition assembly provided by the invention, not only can the radial positions of the wafers on the thimbles be limited by the deposition assembly, but also the processing difficulty of the base can be reduced; and in addition, the harmful effect on the uniformity of the base cooling wafers due to the fact that a through hole is machined in the base is avoided.

The invention relates to a liquid crystal glass raw material feeding method which aims at improving the uniformity and stability of the liquid crystal glass raw material; a steel grid device is additionally arranged at a feed port of a material bin to remove the iron of the batch material; an electronic scale is arranged below the material bin; the raw material is discharged into a material collecting hopper through a flashboard below the electronic scale; the flashboard is connected with the material collecting hopper through a wearable pipe; the material collecting hopper is connected with a mixer; a vibration hitting device is arranged at the lower part of the material collecting hopper; the interior of the mixer adopts highly wear-resistant material; the raw material with small consumption is added into a material bin with larger consumption; the mixer is communicated with a storage tank through a flashboard at the lower part; upon good combination, the mixture is hoisted in a using material bin; the method enables a minimum amount of impurities introduced during the delivery of raw materials; the batch material of the raw material can achieve best uniformity, so the method isespecially suitable for liquid crystal glass production with higher requirements on raw materials.

The invention relates to a fixing structure and a fixing mode of a glass fiber pathway bushing brick, and belongs to the technical field of glass fiber forming. The fixing structure is mainly characterized in that: a bushing brick frame is arranged at the bottom of the bushing brick; the outside periphery of the bushing brick has a double-layer step-shaped structure; the top of the bushing brick frame has a corresponding single-layer step-shaped structure; the bushing brick frame is arranged on the lower surface of a pathway base plate through a bushing brick frame supporting hook; the fixing mode comprises the following steps of: arranging the bushing brick in the bushing brick frame, arranging the bushing brick and the bushing brick frame on the lower surface of the pathway base plate by the bushing brick frame supporting hook by using bolts, and arranging a bushing system on the lower surface of the pathway base plate by a bushing frame supporting hook. By the fixing structure and the fixing mode, damage of the bushing brick, which is caused by replacement of a bushing can be reduced effectively, production efficiency and product quality can be improved, the glass fiber pathway bushing brick can be replaced and assembled by the fixing structure and matching with other tools, replacement time is shortened, and operation staff are reduced.

Provided are: a sealant material composition that makes it possible to ensure favorable sealing properties and suppress travel-associated flowage of a sealant; and a pneumatic tire. The sealant material composition that is for forming a sealant layer on a tire inside surface of a pneumatic tire includes, per 100 parts by mass of a halogenated butyl rubber, 1-40 parts by mass of a crosslinking aidand 50-400 parts by mass of a liquid isobutylene-isoprene copolymer that has a molecular weight of 10,000-60,000.

The invention discloses a preparation method of a TEM (Transmission Electron Microscope) sample. A filling layer is deposited on a preset section in a preparation process of the TEM sample, so that when preparing the TEM sample of a semiconductor structure having a structure with high depth-to-width ratio or a pore structure, local damage of the TEM sample due to overhigh ion beam cutting speed of a non-filled pore edge region generated when a metal protection layer cannot completely fill the structure with high depth-to-width ratio or the pore structure is avoided, and the problem that the bad uniformity of the TEM sample affects the TEM analysis quality is overcome, thus the uniformity of the TEM sample is guaranteed, and further, the analysis quality of the TEM sample is improved, and the observing accuracy of the TEM sample is improved.

The invention discloses a ternary boride reinforced Ti(C,N)-based cermet material and a preparation method thereof. The main preparation process is: using Ti(C,N) cermet raw material powder, carbide and nitride boride powder, binder phase raw material powder; binary boride powder as raw materials, through ball milling, drying, molding and sintering steps Ti(C,N)-based cermets are prepared, in which the second-phase ceramic particles generated by in-situ reaction are finely dispersed in the binder phase of the cermet material, and the presence of this phase can effectively improve the hardness and toughness. Compared with the existing coating and surface treatment technologies to enhance wear resistance, the obtained Ti(C,N)-based cermet material has a Rockwell hardness of 91.5-94HRA and a bending strength of 1800-2800MPa , the fracture toughness can reach 12~15MPa·m ‑1 / 2 In addition, the measured wear scar depth of the Ti(C,N)-based cermet material prepared by this method is about 70% lower than that of the same binder phase cermet, and the friction coefficient is about 0.1 lower.