Circuit board structure

A circuit board and circuit technology, applied in printed circuits, printed circuits, printed circuit manufacturing, etc., can solve the problems of numerous and complex process steps, and difficult to remove the residues of the patterned photoresist layer, so as to improve the process yield, The effect of simplifying process steps and improving process efficiency

Pending Publication Date: 2018-02-06
同扬光电(江苏)有限公司
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Problems solved by technology

However, the above-mentioned process steps are numerous and quite complicated, and the residue of the patterned

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  • Circuit board structure
  • Circuit board structure
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[0037] The foregoing and other technical content, features, and effects of the present invention will be clearly presented in the detailed description of each embodiment below with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only for directions with reference to the attached drawings. Therefore, the directional terms used are for illustration, but not for limiting the present invention. In addition, in the following embodiments, the same or similar components will use the same or similar reference numerals.

[0038] Figure 1A to Figure 1G It is a schematic diagram of a circuit board structure according to an embodiment of the present invention. The manufacturing method of the circuit board structure of this embodiment may include the following steps. First, please refer to Figure 1A , A first metallizable insulating substrate 110 is provided, which in...

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Abstract

The invention provides a circuit board structure, which comprises a metallizable insulating substrate, an electroless plating seed layer and a patterned circuit layer. The metallizable insulating substrate includes an upper surface, a lower surface opposite to the upper surface, through holes and a plurality of circuit grooves, wherein the through holes penetrate through the metallizable insulating substrate, and the circuit grooves are respectively arranged on the upper surface and the lower surface. The electroless plating seed layer covers the inner walls of the circuit grooves and the through holes. The patterned circuit layer is disposed on the electroless plating seed layer, and the patterned circuit layer fills the circuit groove and at least covers the inner wall of the through hole. The invention effectively simplifies the process steps of the circuit board structure, improves the process efficiency, and also avoids the problem that the existing photoresist layer is difficult to remove, thereby improving the process yield of the circuit board structure.

Description

technical field [0001] The invention relates to a circuit board structure, in particular to a circuit board structure with embedded circuits. Background technique [0002] The current circuit board technology has developed an embedded circuit board, and this circuit board has a structure with embedded circuit. In detail, the feature of the embedded circuit board is that the wiring on the surface is embedded in the dielectric layer instead of protruding from the surface of the dielectric layer. [0003] Generally speaking, the known process of circuit board structure with embedded circuits firstly provides a substrate covered with a copper layer. Next, coating a patterned photoresist layer on the copper layer, wherein the patterned photoresist layer exposes part of the copper layer. Next, electroplating is performed on the exposed part of the copper layer to form a circuit layer. Then remove the patterned photoresist pattern layer. Then, a prepreg is pressed on the circui...

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Application Information

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IPC IPC(8): H05K1/02H05K1/11H05K3/10H05K3/46
CPCH05K1/0298H05K1/115H05K3/107H05K3/4644H05K2203/072H05K2203/0723H05K2201/09509
Inventor 刘逸群陈颖星陈慕佳洪培豪沈建成李远智
Owner 同扬光电(江苏)有限公司
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