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Circuit board structure

A circuit board and circuit technology, applied in printed circuits, printed circuits, printed circuit manufacturing, etc., can solve the problems of numerous and complex process steps, and difficult to remove the residues of the patterned photoresist layer, so as to improve the process yield, The effect of simplifying process steps and improving process efficiency

Pending Publication Date: 2018-02-06
同扬光电(江苏)有限公司
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, the above-mentioned process steps are numerous and quite complicated, and the residue of the patterned photoresist layer is difficult to remove, which will also affect the process yield of the circuit board structure

Method used

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  • Circuit board structure
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Embodiment Construction

[0037] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the accompanying drawings. Accordingly, the directional terms used are illustrative, not limiting, of the invention. Also, in the following embodiments, the same or similar components will use the same or similar symbols.

[0038] Figure 1A to Figure 1G is a schematic diagram of a circuit board structure according to an embodiment of the present invention. The manufacturing method of the circuit board structure in this embodiment may include the following steps. First, please refer to Figure 1A , providing a first metallizable insulating substrate 110 comprising an upper surface 1...

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Abstract

The invention provides a circuit board structure including a metalizable insulation substrate, a chemical coating seed layer and a patterning circuit layer. The metalizable insulation substrate includes an upper layer, a lower layer opposite to the upper layer, a through hole and a plurality of circuit grooves, wherein the through hole penetrates through the metalizable insulation substrate and the circuit grooves are arranged in the upper surface and the lower surface. The chemical coating seed layer covers the inner walls of the circuit grooves and through hole. The patterning circuit layeris arranged on the chemical coating seed layer and the fills the circuit grooves and at least covers the inner wall of the through hole. According to the invention, processing steps for the circuit board structure are simplified effectively and technology efficiency is improved. At the same time, a problem that a prior light resistance layer cannot be removed can be avoided and technology yield ofthe circuit board structure can be improved.

Description

technical field [0001] The invention relates to a circuit board structure, in particular to a circuit board structure with embedded circuits. Background technique [0002] The current circuit board technology has developed an embedded circuit board, and this circuit board has a structure with embedded circuit. In detail, the feature of the embedded circuit board is that the wiring on the surface is embedded in the dielectric layer instead of protruding from the surface of the dielectric layer. [0003] Generally speaking, the known process of circuit board structure with embedded circuits firstly provides a substrate covered with a copper layer. Next, coating a patterned photoresist layer on the copper layer, wherein the patterned photoresist layer exposes part of the copper layer. Next, electroplating is performed on the exposed part of the copper layer to form a circuit layer. Then remove the patterned photoresist pattern layer. Then, a prepreg is pressed on the circui...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/11H05K3/10H05K3/46
CPCH05K1/0298H05K1/115H05K3/107H05K3/4644H05K2203/072H05K2203/0723H05K2201/09509
Inventor 刘逸群陈颖星陈慕佳洪培豪沈建成李远智
Owner 同扬光电(江苏)有限公司
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