Carriers for polishing, manufacturing method for carriers for polishing, and magnetic disc substrate manufacturing method

A manufacturing method and substrate technology, applied in the direction of work carriers, etc., can solve the problems of reducing yield and so on

Active Publication Date: 2016-07-20
HOYA CORP
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the above-mentioned flaws cause a decrease in yield when manufacturing glass substrates or magnetic disks.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Carriers for polishing, manufacturing method for carriers for polishing, and magnetic disc substrate manufacturing method
  • Carriers for polishing, manufacturing method for carriers for polishing, and magnetic disc substrate manufacturing method
  • Carriers for polishing, manufacturing method for carriers for polishing, and magnetic disc substrate manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0116] Next, the method of manufacturing the polishing carrier and the magnetic disk substrate of the first embodiment will be described in detail. In the present embodiment, the grinding process includes grinding of a glass substrate and grinding of the glass substrate to reduce the roughness of the glass main surface of the ground glass substrate. Therefore, the carrier for grinding|polishing process means what can be used for grinding and polishing of a glass substrate. The carrier according to the embodiment described below will be described for the case where it is used for grinding, but it can also be used for grinding.

[0117] The inventors of the present application conducted earnest studies on carriers and substrates such as glass substrates in order to solve the conventional problems. The carrier is constituted by a plate (plate material) obtained by impregnating a resin material with a glass fabric in which glass fibers are oriented in two directions different fro...

no. 2 Embodiment approach

[0176] Next, the polishing carrier, the manufacturing method of the polishing carrier, and the manufacturing method of the magnetic disk substrate of the second embodiment will be described in detail.

[0177] Research by the present inventors revealed that when the carrier described in Patent Document 1 is used for polishing treatment, foreign matter adheres to the main surface of the glass substrate, causing contamination or scratches (fine scratches). Specifically, after grinding using the carrier on which the buffer region of the holding hole is formed, it can be seen that the strength near the inner wall surface of the holding hole is reduced, and a part of the resin material constituting the carrier is dropped (missing), and the glass after the grinding process The main surface of the substrate is contaminated by adhering foreign matter. In addition, scratches may be formed on the main surface of the glass substrate. In addition, the inventors of the present invention c...

Embodiment 1

[0232] Embodiment 1: as Figure 4 As shown, in the case where one holding hole includes eight convex first curved surfaces (notches)

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Outer diameteraaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to view more

Abstract

A carrier for polishing is formed from a composite material containing fibers oriented at least in one direction and resin material, and has a retaining hole for retaining a disc-shaped substrate when polishing a pair of main surfaces of the substrate by sandwiching the substrate with a top surface plate and a bottom surface plate. The retaining hole has, on the periphery of an inner circumferential wall face of the retaining hole: a first wall that is configured so that the substrate contacts the fibers in a state where the substrate is retained in the retaining hole; and a second wall that is configured so that the substrate does not contact the fibers. The second wall is formed in a portion of the inner circumferential wall face that faces in the direction, which includes the one direction, of fiber orientation.

Description

technical field [0001] The present invention relates to a polishing carrier used for polishing a substrate, a method for manufacturing the carrier for polishing, and a method for manufacturing a substrate for a magnetic disk. Background technique [0002] Conventionally, a glass substrate has been preferably used as a magnetic disk used as one of the information recording media. At present, in response to the need to increase the storage capacity of hard disk drives, attempts have been made to increase the density of magnetic recording. In such a case, the flying distance of the magnetic head from the magnetic recording surface is extremely short, and the magnetic recording information area is miniaturized. Regarding the size and shape of the glass substrate used for such a magnetic disk, it is preferable to manufacture it precisely according to the objective. [0003] In order to make the size and shape of the glass substrate with high precision, the surface of the glass ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B24B37/28
CPCB24B37/28
Inventor 玉置将德中川裕树
Owner HOYA CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products