Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A high conductance high reliability ce‑sn‑ag‑cu solder for electronic packaging

An electronic packaging, ce-sn-ag-cu technology, applied in the field of high-conductivity and high-reliability Ce-Sn-Ag-Cu solder, can solve the problems of solder conductivity and reliability that cannot meet the strict requirements of electronic packaging, and achieve Improve oxidation and corrosion resistance, electrical and thermal conductivity, high dimensional stability, and strong drop resistance of solder joints

Inactive Publication Date: 2018-02-13
CENT SOUTH UNIV +1
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the electrical conductivity and reliability of Ce-Sn-Ag-Cu solder still cannot meet the stringent requirements of existing electronic packaging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A high conductance high reliability ce‑sn‑ag‑cu solder for electronic packaging
  • A high conductance high reliability ce‑sn‑ag‑cu solder for electronic packaging
  • A high conductance high reliability ce‑sn‑ag‑cu solder for electronic packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] A high-conductivity and high-reliability Ce-Sn-Ag-Cu solder suitable for electronic packaging. The main metal elements of the solder alloy are Ce, Sn, Ag, Cu and Be. Solder may also contain unavoidable impurity elements.

[0026] As a further improvement of the above solder, the mass percentage of the main metal elements in the solder alloy is: Ag: 2.0-3.8%, Cu: 0.4-0.7%, Ce: 0.01-0.7%, Be: 0.01-1.0%, and the balance is Sn .

[0027] As a further improvement of the above solder, the mass percentage of the main metal elements in the solder alloy is: Ag: 3.0-3.8%, Cu: 0.5-0.7%, Ce: 0.02-0.7%, Be: 0.2-0.5%, and the balance is Sn .

[0028] As a further improvement of the above solder, the mass addition ratio of Ag to Cu in the solder alloy is (5-6):1, preferably, the mass addition ratio of Ag to Cu is (5-5.4):1.

[0029] As a further improvement of the above solder, the mass addition ratio of Ce and Be in the solder alloy is 1:(1-2), preferably, the mass addition ratio ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses high-electrical-conductivity and high-reliability Ce-Sn-Ag-Cu solder suitable for electronic packaging. Main metal elements of solder alloy include Ce, Sn, Ag, Cu and Be. According to the solder, by adding a trace amount of Be to the Ce-Sn-Ag-Cu solder alloy, the oxidation corrosion resistance, electrical conductivity and thermal conductivity of the solder alloy are improved unexpectedly; and after welding, the dimensional stability of welding spots are high, the anti-dropping capability of the welding spots is high, and strict requirements of existing electronic packaging can be met.

Description

technical field [0001] The invention relates to a high-performance solder, in particular to a high-conductivity and high-reliability Ce-Sn-Ag-Cu solder suitable for electronic packaging. Background technique [0002] With the development of thin, light, small, digital and multi-functional electronic products, the development trend of miniaturization, precision and high performance of electronic components will be further accelerated, which will increase the number of solder joints used in electronic packaging , The size becomes smaller and the spacing becomes narrower and narrower, but the thermal, electrical and mechanical loads it bears are getting higher and higher. Studies have shown that 70% of the failures of electronic devices are caused by the failures of packaging and assembly, among which the failure of solder joints is the main reason. [0003] Solder joints can not only serve as electrical channels in electronic packaging, but also provide mechanical connections...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
CPCB23K35/0222B23K35/262
Inventor 王斌涂晓萱王亚军李金州樊学农
Owner CENT SOUTH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com