MEMS (Micro Electro Mechanical Systems) cantilever structure and manufacturing method thereof

A technology of cantilever beam and dry etching, which is applied in the field of semiconductors, can solve the problems of adhesion to base materials, fracture free moving ends, adhesion, etc., and achieve the effects of reducing contact area, reducing fracture risk, and preventing adhesion
CN105836697AActive Publication Date: 2016-08-10SEMICON MFG INT (SHANGHAI) CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SEMICON MFG INT (SHANGHAI) CORP
Publication Date
2016-08-10

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Abstract

The invention provides an MEMS (Micro Electro Mechanical Systems) cantilever structure and a manufacturing method thereof. The manufacturing method comprises the following steps: 1) providing a substrate, etching one end of the substrate to form a plurality of first trenches, and filling the trenches with a medium material; 2) depositing a sacrificial layer on a surface of the substrate, and etching the sacrificial layer and the other end of the substrate to form a contact hole; 3) growing an isolation layer on a side wall of the contact hole; 4) filling the contact hole with a conducting material, performing etching to form a plurality of second trenches, and filling the second trenches with a cantilever material till the conducting material covers the surfaces of the conducting material and the sacrificial layer; and 5) removing the sacrificial layer to form the cantilever structure. According to the MEMS cantilever structure, the first trenches are formed in the substrate and filled with the medium material on one hand, so that a contact area between a cantilever and the substrate can be reduced, and electrostatic attraction is reduced, thereby preventing adhesion of a free end of the cantilever. On the other hand, a root connection end of the cantilever has an embedded molding structure, so that root bending torque can be improved, and the fracture risk is lowered.
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Description

technical field

[0001] The invention relates to the technical field of semiconductors, in particular to a MEMS cantilever beam structure and a preparation method thereof. Background technique

[0002] MEMS (Micro-Electro-Mechanical Systems) technology is a high-tech that has developed rapidly in recent years. It uses advanced semiconductor manufacturing technology to realize batch manufacturing of MEMS devices. , weight and price have considerable advantages.

[0003] In the MEMS micromechanical structure, the cantilever beam structure is a very widely used structure. Relying on the up and down vibration of the cantilever beam, it will cause the change of the space charge, thereby causing the change of the signal, and achieving the purpose of structural design. Therefore, for the stress system of the material and The elastic coefficient becomes extra sensitive and important.

[0004] Such as figure 1 and figure 2 Shown is the flow chart of the cantilever beam structure ...

Claims

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