Flip chip LED chip packaging method and packaging groove mould

Abstract

The invention provides a flip chip LED chip packaging method and a packaging groove mould. The packaging groove mould comprises groove bottom, a groove wall and a number of projections which are arranged at the groove bottom, wherein a groove body is surrounded by the groove bottom and the groove wall. Each projection is provided with a die bond zone used for die bond of a flip chip LED chip. The minimum height of the groove wall is higher than the height of the plane of the die bond zone of each projection. The method comprises the steps that a, the packaging groove mould, the flip chip LED chip, a first and second packaging adhesives are provided; b, die bond is carried out on the downward light emitting face of the flip chip LED chip in the die bond zone of a projection; c, the liquid first packaging adhesive is poured into the packaging groove mould; d, curing die release is carried out to form a first molded body, wherein the first molded body is provided with grooves matching the projections of the packaging groove mould; e, the liquid second packaging adhesive is poured into the grooves; f, curing is carried out to form a second molded body; and g, cutting into single LED packaging bodies is carried out. The flip chip LED chip packaging method and the packaging groove mould have the advantages of simple operation, low cost, high pass rate, wide packaged product application range and the like.

Description

technical field [0001] The invention relates to the field of semiconductor lighting, in particular to a packaging method for flip-chip LED chips that is easy to operate, low in cost and high in pass rate and widely used in packaged products, and a packaging groove mold used in the method. Background technique [0002] LED (Light Emitting Diode), light-emitting diode, is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electricity into light. Compared with ordinary lamps (incandescent lamps, etc.), LED lights have the advantages of energy saving, long life, good applicability, short response time, and environmental protection. [0003] The traditional packaging of LED is to fix the chip on the substrate first, and then implement the packaging process on the chip on the substrate. The LED device formed by this packaging process, on the one hand, the chip may move during the packaging process, resulting in Th...

AI Technical Summary

Problems solved by technology

But this method has a shortcoming that is difficult to overcome, that is, when the LED chip is placed in the fluorescent glue, the fluorescent glue has a certain fluidity at this time to ensure that the other five surfaces of the LED chip are covered in the fluorescent glue, but the LED chip is placed in the fluorescent glue. There is no fixed attachment point in the fluorescent glue, and it is impossible to accurately control the depth of the LED chip placed in the fluorescent glue and the horizontal state of the LED chip, resulting in insufficient or too much coating of the fluorescent glue, or packaging into an LED package. The P / N electrodes of the chip are in a tilted state and cannot be used in the future, resulting in a low pass rate of products after packaging by this method, further increasing production costs

[0007] Furthermore, in the prior art, one-time encapsulation and molding methods are adopted, and the light-emitting angle and uniformity of the LED packaging monomers are single, and the light-emitting angle and uniformity cannot be effectively adjusted according to specific light requirements.

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