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Photo/moisture-curable resin composition, adhesive for electronic component, and adhesive for display element

A resin composition, moisture curing technology, applied in the direction of adhesives, polyurea/polyurethane adhesives, adhesive types, etc., can solve the problems of insufficient adhesive reliability, creep resistance, etc.

Active Publication Date: 2016-08-31
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of using the light-moisture-curable resin composition disclosed in Patent Document 2, there are adhesiveness when bonding substrates and other adherends, and reliability in high-temperature environments and high-temperature and high-humidity environments (specifically, preparation is the problem that creep resistance) becomes insufficient

Method used

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  • Photo/moisture-curable resin composition, adhesive for electronic component, and adhesive for display element
  • Photo/moisture-curable resin composition, adhesive for electronic component, and adhesive for display element
  • Photo/moisture-curable resin composition, adhesive for electronic component, and adhesive for display element

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0140] (Synthesis example 1 (production of urethane prepolymer A))

[0141] 100 parts by weight of polytetramethylene ether glycol (manufactured by Mitsubishi Chemical Corporation, "PTMG-2000") and 0.01 part by weight of dibutyltin dilaurate as a polyol compound were put into a separable flask with a capacity of 500 mL. , under vacuum (20 mmHg or less), stirred at 100° C. for 30 minutes, and mixed. Thereafter, under normal pressure, 26.5 parts by weight of diphenylmethane diisocyanate (manufactured by Nisso Shoji Co., Ltd. "PureMDI") was added as a polyisocyanate compound, stirred at 80° C. for 3 hours, and reacted to obtain a urethane prepolymer. Material A (weight average molecular weight 2700).

Synthetic example 2

[0142] (Synthesis example 2 (production of urethane prepolymer B))

[0143] 100 parts by weight of polypropylene glycol (manufactured by Asahi Glass Co., Ltd. "EXCENOL 2020") and 0.01 part by weight of dibutyltin dilaurate as a polyol compound were put into a separable flask with a capacity of 500 mL. °C for 30 minutes for mixing. Thereafter, under normal pressure, 26.5 parts by weight of diphenylmethane diisocyanate (manufactured by Nisso Shoji Co., Ltd. "Pure MDI") was added as a polyisocyanate compound, stirred at 80° C. for 3 hours, and reacted to obtain a urethane precursor. Polymer B (weight average molecular weight 2900).

Synthetic example 3

[0144] (Synthesis example 3 (production of urethane prepolymer C))

[0145] In a reaction vessel containing the urethane prepolymer A obtained in the same manner as in Synthesis Example 1, 1.3 parts by weight of hydroxyethyl methacrylate and N-nitrosophenylhydroxylamine as a polymerization inhibitor were added. 0.14 parts by weight of aluminum salt (manufactured by Wako Pure Chemical Industries, Ltd., "Q-1301") was stirred and mixed for 1 hour at 80°C under a nitrogen stream to obtain a urethane prepolymer having isocyanate groups and methacryloyl groups at molecular terminals. C (weight average molecular weight 2900).

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Abstract

The purpose of the present invention is to provide a photo / moisture curable resin composition having excellent adhesion and reliability in a high-temperature environment or a high-temperature high-humidity environment. The purpose of the present invention is also to provide an adhesive for an electronic component and an adhesive for a display element, the adhesives being obtained using the photo / moisture-curable resin composition. The composition is a photo / moisture-curable resin composition containing a radical polymerizable compound, a moisture-curable urethane resin, a photoradical polymerization initiator, and a coupling agent is provided.

Description

technical field [0001] The present invention relates to a light-moisture-curable resin composition excellent in adhesiveness and reliability in a high-temperature environment and a high-temperature, high-humidity environment. Moreover, this invention relates to the adhesive agent for electronic components and the adhesive agent for display elements which use this optical moisture-curable resin composition. Background technique [0002] In recent years, liquid crystal display elements, organic EL display elements, and the like have been widely used as display elements featuring thinness, light weight, low power consumption, and the like. In these display elements, the photocurable resin composition is generally used for sealing liquid crystals and light-emitting layers; bonding substrates, optical films, protective films, and various members; and the like. [0003] However, in today's era when mobile devices with various display elements such as mobile phones and portable ga...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F2/44C08K5/5415C08L75/04
CPCC08F2/44C08K5/5415C08L75/04C08F290/147C08G18/307C09J175/04C08K2201/011C08K2201/005
Inventor 结城彰高桥彻木田拓身
Owner SEKISUI CHEM CO LTD