Working medium contact type cooling system for high-power electric power device

Abstract

The invention relates to a working medium contact type cooling system for a high-power electric power device. The working medium contact type cooling system comprises a liquid working medium box filled with an insulating heat-conduction liquid working medium, multiple mounting plates, the high-power electric power device, a header pipe liquid dispenser, and multiple liquid working medium spraying pipes, wherein the multiple mounting plates are vertically arranged in parallel; the high-power electric power device is mounted on one sides and/or two sides of the mounting plates; the header pipe liquid dispenser is connected with the liquid working medium box through a main pipeline; multiple liquid spraying openings are uniformly formed in the multiple liquid working medium spraying pipes; the multiple liquid working medium spraying pipes are vertically arranged on one sides and/or two sides of the mounting plates and connected with the header pipe liquid dispenser; the spraying directions of the spraying openings are corresponding to the position of the high-power electric power device; and the liquid working medium sprayed to the high-power electric power device from the liquid spraying openings flows back to the liquid working medium box. The vaporous liquid heat-conduction working medium is in direct contact with the heating surface of the device, so that any middle medium and any heat-transfer switching link are not required, and the heat exchanging efficiency is dramatically improved consequently.

Description

technical field [0001] The invention relates to a working fluid contact cooling system for high-power electric devices, belonging to the field of cooling systems for high-power electric devices. Background technique [0002] High-power power devices mostly refer to compound voltage-driven power semiconductor devices, such as IGBT, IGCT, and IEGT. These devices have low driving power and low saturation voltage, high input resistance, fast switching speed, low on-state voltage, blocking The characteristics of high voltage and large current have become the mainstream of the development of power electronic devices today, and are widely used in power electronic circuits in various fields such as AC motors, frequency converters, switching power supplies, lighting circuits, and traction drives. [0003] But when high-power devices work, the heat generated will increase the temperature of the chip. If the heat dissipation is slow, the temperature of the chip may rise to exceed the m...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a working fluid contact cooling system for high-power power devices, which overcomes the existing heat transfer through the intermediate medium and the increase in thermal resistance in the prior art when the high-power devices are working. The heat conduction efficiency is reduced, and the heat cannot be dissipated in time, which will easily cause high-power heat accumulation, make the junction temperature of electronic devices too high, and cause the performance of the device to deteriorate or fail.

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