Double-layer chip scale package (CSP) light source and manufacturing method thereof

Abstract

The invention provides a double-layer chip scale package (CSP) light source. The light source comprises a luminous chip, a fluorescent gel layer surrounding the luminous chip, and a transparent gel layer surrounding the fluorescent gel layer. A manufacturing method of the double-layer CSP light source comprises the following steps: (1) the luminous chip is placed on a carrier plate; (2) the luminous chip is surrounded by fluorescent gel, so that the fluorescent gel layer is formed; (3) the fluorescent gel layer is packaged by the transparent gel layer; (4) baking curing is carried out to form the double-layer CSP light source. The double-layer CSP light source and the manufacturing method thereof provided by the invention have the advantages that fluorescent powders are distributed in a super-thin gel film and close to the luminous chip, so that generated heat can be easily conducted to a substrate through the chip, and higher temperature resistance can be further achieved; the fluorescent layer can be prevented from damage through the outermost silica gel, so that the problem of chromaticity coordinate changes of an ordinary five-sided CSP light source is solved.

Description

【Technical field】 [0001] The invention relates to the lighting field, in particular to a double-layer structure chip-scale packaging light source and a manufacturing method thereof. 【Background technique】 [0002] The new chip-scale package LED light source (CSP light source) based on flip-chip is equipped with electrodes on the bottom of the chip, and the colloid is directly packaged on the upper surface and side of the chip, so that the electrodes on the bottom surface are exposed. Since this packaging structure has no support or substrate , can reduce packaging cost. Existing chip-scale packaged light sources usually adopt five-sided light emitting, that is, both the top surface and the four sides of the LED can emit light. see figure 1 and figure 2 , the common five-sided CSP (Chip Scale Package, Chip Scale Package) light source is surrounded by the fluorescent colloid 120 containing the phosphor powder 130 to surround the light-emitting chip 110 , and there is no pr...

AI Technical Summary

Problems solved by technology

Ordinary five-sided CSP light source, because the phosphor powder is evenly dispersed in the fluorescent glue, the phosphor powder is excited by the blue light emitted by the light-emitting chip, and generates new light waves while releasing a large amount of heat. Due to the limited thermal conductivity of silica gel, the distance from the light-emitting chip is close Phosphor powder particles, the heat generated by it is easy to conduct to the substrate through the light-emitting chip; but the heat generated by the phosphor particles far away from the light-emitting chip is blocked by silica gel, and it is difficult to conduct to the light-emitting chip and the substrate; after the light source works for a long time, The undissipated heat continues to accumulate, eventually exceeding the temperature resistance limit of silica gel, resulting in colloidal fragmentation of the light source, resulting in the following problems: (1) The fluorescent colloid is easily damaged during use, and the colloid is incomplete, resulting in changes in the color coordinates of the light source ; (2) Under long-term work, the heat generated by CSP is difficult to conduct to the substrate, resulting in the light source being prone to fragmentation of fluorescent colloid, failure of the light source, and short life

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