Resin binder grinding tool and manufacturing method thereof

Abstract

The invention provides a resin binder grinding tool and a manufacturing method thereof, and belongs to the technical field of machining equipment. The resin binder grinding tool comprises a substrate and a grinding layer. Raw materials of the grinding layer comprise, by weight, 61-66 parts of phenolic resin powder, 0-8 parts of zinc oxide, 0-5 parts of barium sulfate, 0-4 parts of sodium carbonate, 5-9 parts of semi-hydrated gypsum powder, 3-4 parts of white carbon black, 5-10 parts of poly-butyraldehyde, 3-6 parts of zinc stearate, 0-6 parts of zirconium oxide and 4.5-5 parts of diamond. The resin binder grinding tool made from the raw materials is suitable for accurate grinding of tile biscuits.

Description

technical field [0001] The invention relates to an abrasive tool and a manufacturing method thereof, in particular to a resin bonded abrasive tool and a manufacturing method thereof. Background technique [0002] In the process of producing ceramic tiles, a layer of glaze is laid on the tile biscuit by means of glazing or spraying. In order to improve the flatness of the surface of the tiles and reduce the amount of glaze used, before the glazing or spraying process, Grinding wheels are required to polish the tile blanks. [0003] In the process of polishing tile greens, it is usually necessary to carry out rough grinding, intermediate grinding and fine grinding on the tile greens in order to achieve the required roughness. The ceramic tiles are finely ground. [0004] Such as figure 1 As shown, it is a resin bonded grinding wheel commonly used for polishing ceramic tile blanks. It is composed of a mandrel 011 and a grinding layer 012 fixed outside the mandrel 011. The gr...

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Problems solved by technology

[0004] like figure 1 As shown, it is a resin bonded grinding wheel commonly used for polishing ceramic tile blanks. It is composed of a mandrel 011 and a grinding layer 012 fixed outside the mandrel 011. The grinding layer 012 is made of resin bond, diamond and additives. However, since the fine grinding process of the resin bonded grinding wheel on the tile blank is dry grinding, the heat generated in the whole process is large, which leads to the rapid wear of the diamond. As the wear of the diamond becomes blunt, the resistance it receives continues to increase However, the wear rate of the existing resin bond carcass cannot match the cutting edge shedding cycle of the diamond, resulting in the lack of subsequent diamond cutting or insufficient cutting height, which is manifested by insufficient grinding sharpness, which makes the existing resin bond abrasives unsuitable In addition, because the wear speed of the resin bond matrix does not match the cutting edge shedding cycle of the diamond, there is no diamond involved in the grinding, and the bond matrix directly rubs against the tile green in a large area , manifested as surface blackening

[0005] In addition, when the abrasive tool with this structure polishes the tile green, the working peripheral surface 0120 of the grinding layer 012 is in hard contact with the surface of the tile green, and the amount of grinding is large, enabling rapid polishing. However, due to the certain deformation of the tiles, the surface is high in the middle and low in the surroundings or high in the middle of both ends and bottoms, and there is usually a problem of 30% missed throwing.

[0006] In order to reduce the missed throwing rate, abrasive belts are usually used instead of grinding wheels to polish the tile blanks. Although the missed throwing rate is reduced, the polishing life of the abrasive belt is usually one day, resulting in frequent replacement of the abrasive belt, which is not conducive to reducing the tile quality. production cost

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