Apparatus for removing and polishing optical material, method of use and application thereof

Abstract

The invention relates to an optical machining device, in particular to a device for removing and polishing optical materials and an application method and applications thereof. The device comprises a housing composed of a stainless steel tube wall and an insulating ceramic bushing. Two ends of the housing are provided with a working gas inlet and a jet gun. An inner electrode is disposed inside the insulating ceramic bushing. A turbine gas circuit distributor is disposed inside the working gas inlet. The surface of the inner electrode is coated with a TiN coating. The stainless steel tube wall is made of 1Cr18Ni9Ti and is not smaller than 3mm in thickness. The turbine gas circuit distributor is made of dielectric ceramic. The part of the stainless steel tube wall, close to one end of the jet gun, is provided with evenly distributed active reactant gas inlets. The device is applicable to removing and polishing optical materials such as quartz and sapphire and is high in removal rate, low in machining cost, highly adaptable and convenient to industrially apply.

Description

technical field [0001] The invention relates to an optical processing device, in particular to a device for removing and polishing optical materials and its use method and application. Background technique [0002] Arc plasma technology is one of the mainstream technologies in the field of plasma applications. Because arc plasma equipment and technology are relatively simple, arc discharge energy is concentrated, and controllability is good, it is widely used in mechanical processing, metallurgy, chemical engineering, and environmental protection. field has been widely applied. However, because the arc plasma temperature is too high, it is easy to cause ablation on the processed surface. Therefore, although it has been used to melt high-purity quartz glass for a long time, it has not been used in the field of optical processing so far. [0003] At present, the ultra-smooth surface processing of large-caliber, high-precision and precision optical components has become an imp...

AI Technical Summary

Problems solved by technology

[0004] 1. RF ion sources with a frequency above megahertz are often used, which is likely to cause radio frequency electromagnetic pollution

In addition, corresponding matchers need to be configured according to the specific ion torch device, gas source and gas distribution, and the effective working range of the working parameters is narrow, so the adaptability is poor;

[0005] 2. It is usually necessary to use more expensive helium as the plasma working gas, and in the atmospheric state, the gas consumption of the working gas is much higher than that in the vacuum state, so the processing cost is too high;

[0006] 3. Due to the sputtering effect of the plasma, in order to prevent the metal particles in the electrode from being excited to cause surface contamination, these low-temperature plasma methods usually use a water cooling device to cool the electrode, and limit its working power within a certain range, so that It leads to the complexity of the device structure and affects the processing efficiency

[0007] Therefore, the current atmospheric plasma processing technology still has various limitations in processing technology, processing efficiency and cost.

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