Three-dimensional network through-hole composite and preparation thereof

A technology of three-dimensional network and composite materials, which is applied in the field of three-dimensional network through-hole composite materials and their preparation, and achieves the effects of low processing temperature, excellent mechanical properties and good thermal conductivity.

Inactive Publication Date: 2016-09-21
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there is no report on the three-dimensional network through-hole fiber reinforced silicon carbide containing beryllium (fiber reinforced silicon carbide) composite material and its preparation method

Method used

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  • Three-dimensional network through-hole composite and preparation thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0051] step one

[0052] According to the mass ratio, beryllium-containing polycarbosilane:xylene=1:1, mix them uniformly to obtain the precursor impregnation solution. In the polycarbosilane containing beryllium, the mass percentage of beryllium is 0.2%, and its molecular weight is 11000.

[0053] step two

[0054] A structural member with a pore size of 1.5mm and a porosity of 40% was prepared with resin.

[0055] step three

[0056] Combining the resin structure prepared in step 2 with the pretreated (temperature 500°C; time 2h) continuous fiber weave three-dimensional mesh braid, and immerse it in the precursor solution in step 1, put In a vacuum drying oven, heat to 60°C, the vacuum degree is -0.05MPa, and the time is 12h, to obtain the preform;

[0057] step four

[0058] Place the preform prepared in Step 3 in a muffle furnace and heat it to 260° C., and keep it warm for 3 hours to remove the resin skeleton.

[0059] step five

[0060] Put the prefabricated part ...

example 2

[0066] step one

[0067] According to the mass ratio, beryllium-containing polycarbosilane:xylene=1:3, mix them uniformly to obtain the precursor impregnation solution. In the polycarbosilane containing beryllium, the mass percentage of beryllium is 0.5%, and its molecular weight is 10000.

[0068] step two

[0069] A structural member with a pore size of 3mm and a porosity of 50% was prepared with resin.

[0070] step three

[0071] Combining the resin structure prepared in step 2 with the pretreated (temperature 600°C; time 2h) continuous carbon fiber woven three-dimensional mesh braid, and immersing it in the precursor solution in step 1, putting it into In a vacuum drying oven, heat to 60°C, the vacuum degree is -0.09MPa, and the time is 48h to obtain the preform;

[0072] step four

[0073] Place the preform prepared in Step 3 in a muffle furnace and heat it to 330° C., and keep it warm for 6 hours to remove the resin skeleton.

[0074] step five

[0075] Put the p...

example 3

[0081] step one

[0082] According to the mass ratio, beryllium-containing polycarbosilane:xylene=1:2, mix them uniformly to obtain the precursor impregnation solution. In the polycarbosilane containing beryllium, the mass percentage of beryllium is 0.8%, and its molecular weight is 12000.

[0083] step two

[0084] A structural member with a pore size of 2mm and a porosity of 55% was prepared with resin.

[0085] step three

[0086] Combining the resin structure prepared in step 2 with the pretreated (temperature 500°C; time 1h) continuous carbon fiber woven three-dimensional mesh woven piece, and immersing it in the precursor solution in step 1, putting it into In a vacuum drying oven, heat to 60°C, the vacuum degree is -0.07MPa, and the time is 24h to obtain the preform;

[0087] step four

[0088] Place the preform prepared in Step 3 in a muffle furnace and heat it to 300° C., and keep it warm for 4 hours to remove the resin skeleton.

[0089] step five

[0090] Put...

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Abstract

The invention relates to a three-dimensional network through-hole composite and preparation thereof and belongs to the technical field of design and preparation of through-hole composites. The three-dimensional network through-hole composite comprises a fiber layer and a Be-containing silicon carbide layer coating the fiber layer, wherein the content of Be in the three-dimensional network through-hole composite is higher than or equal to 0.1% in percentage by mass, and the porosity of the three-dimensional network through-hole composite is higher than or equal to 50%. The preparation method of the three-dimensional network through-hole composite comprises steps as follows: fibers are woven on a structural element with the three-dimensional network structure, a prefabricated part is obtained and put into an impregnation liquid to be impregnated, and the impregnated prefabricated part is obtained; the impregnated prefabricated part is heated to 240-360 DEG C and kept at the temperature, and a semi-finished product is obtained; the semi-finished product is put into an oxygen-containing atmosphere to be subjected to pre-oxidation treatment, and a pre-oxidized base is obtained; the pre-oxidized base is sintered finally, and the three-dimensional network through-hole composite is obtained, wherein the sintering temperature ranges from 1,100 DEG C to 1,500 DEG C.

Description

technical field [0001] The invention relates to a three-dimensional mesh through-hole composite material and its preparation, and belongs to the technical field of design and preparation of through-hole composite materials. Background technique [0002] Three-dimensional network through-hole structure composite materials have comprehensive properties such as high porosity, high permeability, large specific surface area, low bulk density, low thermal conductivity, and excellent mechanical properties, and have been widely used in civilian applications. The three-dimensional network through-hole structure composite material and its preparation have also received attention in civil applications. Three-dimensional mesh through-hole composite materials and their preparation methods have an important impact on their properties. The existing porous materials include: foam plastics, foam ceramics (mainly silicon carbide porous ceramics), foam glass and metal foam (mainly copper foam ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B38/06C04B35/80C04B35/84
CPCC04B35/806C04B38/0615C04B2235/5216C04B2235/5224C04B2235/5244C04B2235/5248C04B2235/77C04B2235/96C04B2235/9607C04B38/0022C04B38/0067
Inventor 黄小忠肖路军杜作娟岳建岭王春齐唐秀之许慎微邹杨君谭飞龙成雨果韦勇山周丁王翔宇梁艳梅廖潘兴惠忆聪刘坤胡春华罗璐磊王畅朱文华王强吴辉剑
Owner CENT SOUTH UNIV
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