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Three-axis-linkage automatic sand blasting device for diamond wire polycrystalline silicon slices

A technology for polycrystalline silicon wafers and sandblasting devices, which is used in fine working devices, metal processing equipment, grinding machines, etc., can solve the problems of high equipment cost, environmental pollution, and inability to use industrial production, and achieve uniform processing quality and no environmental pollution. , the effect of high processing efficiency

Active Publication Date: 2016-10-12
BEIJING HEDEFENG MATERIAL TECH
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Problems solved by technology

At present, the silicon wafers used to make solar cells on the market include mortar line monocrystalline silicon wafers, mortar line polycrystalline silicon wafers, and diamond wire monocrystalline silicon wafers. The surface of low-cost diamond wire cut polycrystalline silicon wafers is too smooth to be used for solar energy. Production of cells
At present, the secondary processing technology of diamond wire-cut polysilicon wafers at home and abroad includes chemical black silicon technology, but this technology is still in the experimental stage and cannot be used in industrial production. Serious environmental pollution, occupation of hazardous chemicals, high cost of equipment and many other problems

Method used

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  • Three-axis-linkage automatic sand blasting device for diamond wire polycrystalline silicon slices
  • Three-axis-linkage automatic sand blasting device for diamond wire polycrystalline silicon slices
  • Three-axis-linkage automatic sand blasting device for diamond wire polycrystalline silicon slices

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Embodiment Construction

[0040] Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The description of the exemplary embodiments is for the purpose of illustration only, and in no way limits the invention and its application or usage.

[0041] The surface of the polycrystalline silicon wafer cut by diamond wire is too smooth. In order to solve the problem that the surface of the polycrystalline silicon wafer cut by diamond wire is too smooth, the present invention performs sandblasting treatment on the surface of the polycrystalline silicon wafer cut by diamond wire. The roughness of the surface of the diamond wire polysilicon wafer is improved by sandblasting, so that it can be directly used to make solar cells.

[0042] see figure 1 According to the present invention, the three-axis linkage automatic sandblasting device for diamond wire polysilicon wafers comprises: a vertical transmission mechanism 10, a horizontal transmiss...

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Abstract

The invention discloses a three-axis-linkage automatic sand blasting device for diamond wire polycrystalline silicon slices. The three-axis-linkage automatic sand blasting device comprises a longitudinal transmission mechanism, a transverse transmission mechanism, a vertical transmission mechanism, a spray gun module, a sand pump and a sand vat. The longitudinal transmission mechanism is used for driving the diamond wire polycrystalline silicon slices to enter and exit from a sand blasting area. The transverse transmission mechanism is arranged above the longitudinal transmission mechanism and used for fixing the spray gun module. The transverse transmission mechanism can perform reciprocating motion in the X-axis direction. The output end of the vertical transmission mechanism is connected with the transverse transmission mechanism, and the vertical transmission mechanism is used for driving the transverse transmission mechanism to move in the Z-axis direction. By means of three-axis-linkage of the longitudinal transmission mechanism, the transverse transmission mechanism and the vertical transmission mechanism, multi-freedom-degree numerical control adjustment is achieved; the processing requirement of the multiple types of diamond wire polycrystalline silicon slices can be met; in addition, the cutting depth and the surface microstructure of each diamond wire polycrystalline silicon piece can be strictly controlled; machining quality is uniform; and consistency is good.

Description

technical field [0001] The invention relates to the technical field of solar cells, in particular to a three-axis linkage automatic sandblasting device for diamond wire polysilicon chips. Background technique [0002] The technical background related to the present invention will be described below, but these descriptions do not necessarily constitute the prior art of the present invention. [0003] With the rapid development of my country's solar energy industry, the demand for solar cells continues to expand. How to process low-cost, high-efficiency core raw materials—silicon wafers has become an urgent issue for the industry. At present, the silicon wafers used to make solar cells on the market include mortar line monocrystalline silicon wafers, mortar line polycrystalline silicon wafers, and diamond wire monocrystalline silicon wafers. The surface of low-cost diamond wire cut polycrystalline silicon wafers is too smooth to be used for solar energy. Production of battery...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/00B28D7/04B24B27/06B24B57/02
CPCB24B27/0633B24B57/02B28D5/0064B28D5/007B28D5/0094B28D5/045
Inventor 李名扬唐宵汉华永云刘佳王倩张金光陈永胜
Owner BEIJING HEDEFENG MATERIAL TECH
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