An automatic sandblasting device for diamond wire polysilicon wafers

Abstract

The invention discloses an automatic sand blasting device used for diamond wire polycrystalline silicon slices. The automatic sand blasting device comprises a starting system, a grinding fluid system, a spray gun system, a feeding system, a process bin and a controller. When an operation command input from the outside is a sand blasting command, the controller automatically controls the starting system, the grinding fluid system, the spray gun system and the feeding system to conduct sand blasting treatment on the surfaces of the diamond wire polycrystalline silicon slices. The automatic sand blasting device is easy to operate, high in processing precision and processing stability, low in fragmentation rate and high in production capacity. The surfaces of the diamond wire polycrystalline silicon slices are subjected to sand blasting treatment, and consequently the surface microtopography of the diamond wire polycrystalline silicon slices can be changed; and the diamond wire polycrystalline silicon slices subjected to surface treatment can be directly used for production of battery pieces.

Description

technical field [0001] The invention relates to the technical field of solar cells, in particular to an automatic sandblasting device for diamond wire polycrystalline silicon chips. Background technique [0002] The technical background related to the present invention will be described below, but these descriptions do not necessarily constitute the prior art of the present invention. [0003] With the rapid development of my country's solar energy industry, the demand for solar cells continues to expand. How to process low-cost, high-efficiency core raw materials—silicon wafers has become an urgent issue for the industry. At present, domestic solar silicon wafer processing methods have The following types: [0004] Mortar wire cutting monocrystalline silicon technology: high manufacturing cost of monocrystalline silicon, low efficiency of mortar wire cutting technology, and high fragmentation rate; [0005] Mortar wire cutting polysilicon technology: polysilicon manufactur...

AI Technical Summary

Problems solved by technology

[0007] Black silicon technology: high equipment cost and serious environmental pollution

[0008] However, the existing silicon wafer processing technologies have problems such as high cost, low processing efficiency, high fragmentation rate, and serious environmental pollution; although the high-efficiency processing rate and low fragmentation rate brought by diamond wire cutting technology have been widely recognized, but The surface of low-cost diamond wire-cut polysilicon wafers is too smooth to be used in the production of solar cells, which sets an insurmountable gap for the application and promotion of diamond wire polysilicon technology

In addition, the current market has high requirements for the production capacity, processing stability, and processing uniformity of silicon wafers used to make solar cells. As a result, the current market does not have a CNC system that can meet the requirements and is compatible with high-precision sandblasting processing centers.

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