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Formula and preparation method of carpentry board bonding compound

A production method and technology of adhesive glue, applied in the direction of adhesive types, aldehyde/ketone condensation polymer adhesives, adhesives, etc., can solve the problems of large environmental pollution, damage to human skin, poor adhesion, etc., and achieve The effects of poor corrosion resistance, simple manufacturing process, and low production cost

Inactive Publication Date: 2016-10-12
泸州金山林木业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention overcomes the deficiencies of the prior art, provides a raw material formula and a production method of woodworking board adhesive glue, and solves the problems of prior woodworking boards such as large environmental pollution, poor adhesion, and damage to human skin

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A raw material formula for wood-board adhesive glue, which includes formaldehyde and urea, and the weight ratio of the formaldehyde and urea is 10:8.

[0019] A method for making wood board adhesive, the steps are as follows:

[0020] (1) Mix formaldehyde and urea according to the weight ratio of 10:8 and add to the reactor, then raise the temperature to 92°C and keep it warm for 50 minutes;

[0021] (2) Add formic acid solution to the mixture treated in step (1), the mass concentration of the formic acid solution is 30%, stir, adjust the pH value so that the pH value is 3.8, keep the temperature at 92°C, keep warm for 20 minutes, continue Add formic acid solution, stir, and adjust the pH value so that the pH value is 3.8, so repeatedly adjust the pH value to 3.8 three times;

[0022] (3) Test the viscosity of the mixed solution. When the viscosity reaches 800cps, stop the reaction, add sodium hydroxide solution to the mixed solution, the mass concentration of sodium o...

Embodiment 2

[0024] A raw material formula of wood-board adhesive glue, which comprises formaldehyde and urea, the weight ratio of the formaldehyde and urea is 9:7.

[0025] A method for making wood board adhesive, the steps are as follows:

[0026] (1) Mix formaldehyde and urea according to the weight ratio of 9:7 and add to the reactor, then raise the temperature to 95°C and keep it warm for 80 minutes;

[0027] (2) Add formic acid solution to the mixture treated in step (1), the mass concentration of the formic acid solution is 50%, stir, adjust the pH value so that the pH value is 5.0, keep the temperature at 95°C, keep warm for 30 minutes, continue Add formic acid solution, stir, and adjust the pH value so that the pH value is 5.0, and adjust the pH value repeatedly for three times;

[0028] (3) Test the viscosity of the mixed solution. When the viscosity reaches 1000cps, stop the reaction, add sodium hydroxide solution to the mixed solution, the mass concentration of the sodium hydr...

Embodiment 3

[0030] A raw material formula for wood-board adhesive glue, which includes formaldehyde and urea, the weight ratio of the formaldehyde and urea is 8:6.

[0031] A method for making wood board adhesive, the steps are as follows:

[0032] (1) Mix formaldehyde and urea according to the weight ratio of 8:6 and add to the reactor, then raise the temperature to 93°C and keep it warm for 65 minutes;

[0033] (2) Add formic acid solution to the mixture treated in step (1), the mass concentration of the formic acid solution is 40, stir, adjust the pH value so that the pH value is 4.4, keep the temperature at 92°C, keep warm for 25min, then continue to add Formic acid solution, stirring, adjusting the pH value so that the pH value is 4.4, so repeatedly adjust the pH value three times;

[0034] (3) Test the viscosity of the mixed solution. When the viscosity reaches 900cps, stop the reaction, add sodium hydroxide solution to the mixed solution, the mass concentration of the sodium hydro...

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PUM

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Abstract

The invention discloses a raw material formula and preparation method of a carpentry board bonding compound. The carpentry board bonding compound is prepared from formaldehyde and urea. The weight ratio of formaldehyde to urea is (8-10):(6-8). The preparation method of the carpentry board bonding compound includes the steps that raw materials are prepared in proportion and then heated to 92-95 DEG C, heat is preserved for 50-80 min, then formic acid is added for a reaction, strong oxidation sodium is used for adjusting the pH value of the material, and then the carpentry board bonding compound is prepared. The raw material formula and preparation method of the carpentry board bonding compound have the advantages that the raw materials are low in price and simple in ingredient, no other chemicals greatly polluting the environment are contained except for formaldehyde, formaldehyde can be emitted out as carpenter's glue becomes dry and hard, and therefore no continuous pollution is caused to the human body and the environment. The preparation process is simple, the production cost is low, the bonding performance is good, corrosivity is poor, and harm to the skin of the human body is low.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a raw material formula and a preparation method of wood-board adhesive glue. Background technique [0002] Adhesive (Bonding agent) is one of the most important auxiliary materials and is widely used in packaging operations. Adhesives are sticky substances that join two separate materials together by virtue of their adhesive properties. There are many types of adhesives: ① natural adhesives ② synthetic adhesives ① water-soluble adhesives ② hot-melt adhesives ③ solvent-based adhesives ④ emulsion adhesives ⑤ solvent-free liquid adhesives. Carpentry glue mostly adopts emulsion type adhesive, and the prior emulsion adhesive has great pollution to the environment, poor adhesion, and has certain corrosivity to human skin. Contents of the invention [0003] The invention overcomes the deficiencies of the prior art, provides a raw material formula and a production method of the adhesive glue...

Claims

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Application Information

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IPC IPC(8): C08G12/12C09J161/24
CPCC08G12/12C09J161/24
Inventor 罗相东
Owner 泸州金山林木业有限公司