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Integrated micro heat pipe radiator based on mems technology

A radiator and micro heat pipe technology, applied in semiconductor devices, electric solid state devices, semiconductor/solid state device components and other directions, can solve the problems of complex preparation process, many layers, complex structure, etc., to achieve high heat dissipation efficiency and improve heat dissipation. Efficiency, improved uniformity effect

Active Publication Date: 2019-05-24
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the patent has a large number of layers, a complex structure, and a relatively complicated preparation process.

Method used

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  • Integrated micro heat pipe radiator based on mems technology
  • Integrated micro heat pipe radiator based on mems technology
  • Integrated micro heat pipe radiator based on mems technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] like figure 1 , figure 2 As shown, the present embodiment provides an integrated micro heat pipe radiator based on MEMS technology, including: a heat dissipation cavity 1, a heat absorption cavity 2, a circulation pipeline 3 and a heat dissipation working medium 4, wherein: the heat dissipation working medium is poured into the integrated micro heat pipe inside the heat pipe radiator.

[0033] The heat dissipation cavity 1, the heat absorption cavity 2, and the circulation pipeline 3 are all arranged in the heat pipe radiator, and the heat dissipation cavity 1, the heat absorption cavity 2, and the circulation pipeline 3 are integrally produced by the electroplating process of MEMS technology;

[0034] The heat dissipation cavity 1 is provided with an internal micro-channel structure 1-1 to facilitate the heat transfer of the heat dissipation working fluid 4 .

[0035] The heat-absorbing cavity 2 is provided with an internal micro-channel structure 2-1, which is conv...

Embodiment 2

[0059] like image 3 As shown, this embodiment provides a microchannel heat sink for heat dissipation of power electronic devices. The connection between the components of this embodiment is the same as that of Embodiment 1, and the composition of the internal channel structures 1-1 and 2-1 is slightly different. There is a difference.

[0060] In this embodiment, the internal micro-channel structures 1-1, 2-1 are rectangular column structures, and micro-channels are formed between the internal channel structures, and the micro-channels include coarse micro-channels and fine micro-channels, The cross-sectional area of ​​the coarse and micro channels is larger than that of the fine channels, and the coarse and micro channels are distributed at intervals, that is, there is a fine channel between two adjacent coarse and micro channels, and the coarse and micro channels are connected to each other. Parallel to narrow the flow path and intensify capillary action.

[0061] Prefera...

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PUM

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Abstract

The invention provides an integrated micro heat pipe radiator based on an MEMS technology, comprising a heat radiating cavity, a heat absorbing cavity, a circulating pipe, and a heat radiating working medium. The heat radiating cavity and the heat absorbing cavity are each provided with an internal micro channel structure, and the circulating pipe is communicated with the internal micro channel structure in the heat radiating cavity and the internal micro channel structure in the heat absorbing cavity. The heat radiating working medium circulates inside the circulating pipe and the internal micro channel structures. The heat radiating working medium is liquid when entering the internal micro channel structure in the heat absorbing cavity, and becomes gas after absorbing heat. The gas working medium enters the internal micro channel structure in the heat radiating cavity through the circulating pipe, is cooled and condensed into liquid in the internal micro channel structure in the heat radiating cavity, and flows back to the heat absorbing cavity through the circulating pipe. According to the invention, the gas heat radiating working medium is cooled and then flows from the heat radiating cavity to the heat absorbing cavity, which helps improve the heat exchange efficiency of the radiator.

Description

technical field [0001] The invention relates to the technical fields of heat dissipation technology and high-efficiency heat exchange based on MEMS technology, and in particular relates to an integrated micro heat pipe radiator based on MEMS technology. Background technique [0002] With the rapid development of science and technology, the high density and miniaturization of electronic devices has become an inevitable trend. Especially for high-power CPU chips, heat dissipation has become an urgent problem to be solved. Due to the miniaturization of CPU chips, the miniaturization of heat pipes also As a trend, microchannels are favored due to their high surface-to-volume ratio and excellent heat dissipation performance. [0003] Existing heat pipes are generally processed by machining, and generally have the disadvantage of large volume of heat pipes, which cannot be placed in electronic equipment. [0004] After searching the existing technology, it was found that Zhao Yao...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427
Inventor 丁桂甫金之钰杨达伟
Owner SHANGHAI JIAOTONG UNIV