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Surface false-patch quartz crystal resonator having grounding welding spot and processing method thereof

A technology of quartz crystal and processing method, which is applied to electrical components, impedance networks, etc., can solve the problems of uncertainty in the directionality of the third lead wire of the quartz crystal resonator resonator, affecting the frequency of the resonator, and complex processing technology. The effect of improving product frequency stability, reducing raw material cost, and simple operation

Active Publication Date: 2016-10-12
MDH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. High cost: It is necessary to process three-lead wires with nail heads, make spot welding equipment, and three-lead bending equipment; at the same time, there is a problem of welding defect rate
[0005] 2. Low efficiency: The processing technology is complex, requiring three-lead processing, importing, spot welding, bending and other processes, and the processing of a single quartz crystal resonator, the labor efficiency is too low
[0006] 3. The directionality of the third lead of the quartz crystal resonator is uncertain: it is necessary to make two ground pads on the circuit board or manually place the direction of the third lead of the resonator in the same direction
[0008] 5. The product stress change caused by bending the third lead affects the frequency of the resonator

Method used

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  • Surface false-patch quartz crystal resonator having grounding welding spot and processing method thereof
  • Surface false-patch quartz crystal resonator having grounding welding spot and processing method thereof
  • Surface false-patch quartz crystal resonator having grounding welding spot and processing method thereof

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Experimental program
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Effect test

Embodiment 1

[0054] In this embodiment, an insulating gasket with one side opening and a mask net are selected to process the quartz crystal resonator, and the specific steps are as follows:

[0055] Step 1. Process the quartz crystal resonator into a surface-mounted quartz crystal resonator with two leads: insert an insulating gasket with one side opening on the quartz crystal resonator, extend a lead wire from each through hole, and Bending to both sides, exposed on the bottom plate of the quartz crystal resonator corresponding to the opening on one side;

[0056] Step 2. Put the surface-mounted quartz crystal resonator processed in step 1 into the test disk, test whether the quartz crystal resonator processed into two leads is qualified, remove unqualified products, and fill the test disk until further After processing qualified products, cover the mask sheet above the test disc; the hollow on the mask sheet used in this embodiment corresponds to the opening on one side of the insulatin...

Embodiment 2

[0061] In this embodiment, the steps of processing are similar to Embodiment 1, and the insulating gasket and the mask net with double-sided openings are selected to process the quartz crystal resonator. In the present embodiment, in the direction of the length of the insulating gasket, the There are openings on both sides, and the areas corresponding to the openings on both sides of the bottom plate of the quartz crystal resonator are exposed, and the structure of the mask is also adjusted so that the hollows on the mask correspond to the positions of the openings on both sides on the insulating gasket.

[0062] The specific processing steps of the present embodiment are:

[0063] Step 1. Process the quartz crystal resonator into a surface-mounted quartz crystal resonator with two leads: insert insulating gaskets with double-sided openings on the quartz crystal resonator, extend a lead wire from each through hole, and Bend to both sides, exposed on the bottom plate of the qua...

Embodiment 3

[0069] In this embodiment, the processing steps are similar to that of Embodiment 1, and the insulating gasket with one side opening is selected. The difference from Embodiment 1 is that the shielding plate of this embodiment is selected from steel mesh, and the solder is metal paste; Corresponds to the opening position on one side of the insulating spacer.

[0070] The concrete process of this embodiment is:

[0071] Step 1. Process the quartz crystal resonator into a surface-mounted quartz crystal resonator with two leads: insert an insulating gasket with one side opening on the quartz crystal resonator, extend a lead wire from each through hole, and Bending to both sides, exposed on the bottom plate of the quartz crystal resonator corresponding to the opening on one side;

[0072] Step 2. Put the surface-mounted quartz crystal resonator processed in step 1 into the test disk, test whether the quartz crystal resonator processed into two leads is qualified, remove unqualifie...

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Abstract

The invention belongs to the field of an electronic component, and particularly relates to a surface false-patch quartz crystal resonator having a grounding welding spot and a processing method thereof. The surface false-patch quartz crystal resonator related by the invention comprises a quartz crystal resonator, and an insulating spacer, wherein the insulating spacer is sleeved on a quartz crystal resonator bottom plate; the insulating spacer forms an exposed area on the bottom plate of the quartz crystal resonator; and the grounding welding spot is formed in the exposed area. The processing method in the invention comprises the steps of forming the exposed area at a position, where needs to be formed into a grounding point, of the surface false-patch quartz crystal resonator, directly enabling a welding material to contact the exposed area, and forming the grounding welding spot on the bottom plate of the surface false-patch quartz crystal resonator via a hot melting process. According to the surface false-patch quartz crystal resonator having the grounding welding spot and the processing method thereof related by the invention, the insulating spacer and the hot melting process are adopted to process the surface false-patch quartz crystal resonator, and a metal welding spot is formed on the exposed part of the surface false-patch quartz crystal resonator bottom plate, so the function of a third lead in the traditional process is substituted.

Description

technical field [0001] The invention belongs to the field of electronic components, in particular to a surface dummy quartz crystal resonator with ground solder joints and a processing method thereof. Background technique [0002] By realizing the conduction between the bottom plate of the quartz crystal resonator on the upper surface of the circuit board and the ground, the accumulation of static electricity on the resonator can be eliminated, and the breakdown of the IC connected to the resonator can be prevented; and the interference in the circuit can be shielded through the grounding wire Signal. In certain electronic products, such as smart meters, a quartz crystal resonator with a grounding function is required. [0003] So far, the process of processing and grounding the bottom plate of the surface-mounted quartz crystal resonator is to weld a metal lead at the bottom plate of the quartz crystal resonator, lead it out from the hole in the insulating gasket, and bend...

Claims

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Application Information

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IPC IPC(8): H03H9/19H03H3/02
CPCH03H3/02H03H9/19
Inventor 黄屹李斌
Owner MDH TECH CO LTD
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