A method for quickly grinding and pasting films on outer circuit boards

Abstract

The invention discloses a rapid board-grinding and film-pasting method for an outer layer circuit board. The rapid board-grinding and film-pasting method comprises the following steps of putting a circuit board; performing acid washing; performing water washing for the first time; grinding the board by a needle brush; grinding the board by volcanic ash; removing the volcanic ash; drying by hot air; preheating the board surface; pasting a film; and collecting the board, wherein the grinding brush used in the step of grinding the board by the needle brush is 450#-550# needle brush; the volcanic ash used in the step of grinding the board by the volcanic ash is 18-25% in concentration; the first group of hot pressing rolling wheels of the film-pasting machine used in the film-pasting step are 68 plus or minus 2 degrees in hardness; the second group of hot pressing rolling wheels of the film-pasting machine used in the film-pasting step are 72 plus or minus 2 degrees in hardness; the two groups of the hot pressing rolling wheels of the film-pasting machine used in the film-pasting step are 5.5-6.5kg / cm<2> in pressure; and the two groups of the hot pressing rolling wheels of the film-pasting machine used in the film-pasting step are 115-135 DEG C in temperatures. By adoption of the rapid board-grinding and film-pasting method, the film-pasting speed can reach 3.8-4.0m / min; and meanwhile, the quality of the product can be ensured.

Description

technical field [0001] The invention belongs to the technical field of PCB board processing, and relates to a method for quickly grinding and pasting films on outer circuit boards. Background technique [0002] The circuit board production process includes: board feeding-acid washing-water washing-needle brush grinding board-volcanic ash grinding board-removing volcanic ash-hot air drying-board surface preheating-film-receiving board. At present, the pretreatment production speed of the outer layer line is generally between 2.5-2.8m / min in the industry; the film lamination speed is between 2.8-3.0m / min, and the single-line production capacity is low; The original production process has insufficient adhesion on the surface of the board, which will cause residual copper if it is slight, and will cause permeation and plating if it is serious, and will cause quality problems such as film throwing if it is more serious. Contents of the invention [0003] Aiming at the deficien...

AI Technical Summary

Problems solved by technology

At present, the pretreatment production speed of the outer layer line is generally between 2.5-2.8m / min in the industry; the film lamination speed is between 2.8-3.0m / min, and the single-line production capacity is low; The original production process has insufficient adhesion on the surface of the board, which will cause residual copper if slight, and will cause seepage plating if severe, and will cause quality problems such as film throwing if serious

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