Heat transfer film automatic alignment transfer printing device suitable for flexible substrate

Abstract

The invention discloses a heat transfer film automatic alignment transfer printing device suitable for a flexible substrate. A substrate positioning mechanism in conventional equipment is mainly improved, and an air cushion type supporting mechanism is used for replacing an original rigid platen. The air cushion type supporting mechanism comprises a silicone rubber air bag cushion opposite to a heat transfer film pressing plate and an air charging device for charging air into the silicone rubber air bag cushion. The silicone rubber air bag cushion is suitable for supporting and being attached to the flexible substrate, especially when the heat transfer film pressing plate drives a cut-off heat transfer film to be pressed downwards, a PLC controls the air charging device to charge air into the silicone rubber air bag cushion so that the silicone rubber air bag cushion can expand and squeeze the flexible substrate, enough feedback force is provided to ensure the attaching closeness and matching precision of the heat transfer film and the flexible substrate together with the upper pressing plate, the product quality of the heat transfer printing process of the flexible substrate is greatly improved, the rejection rate is reduced, and cost is reduced for enterprises.

Description

technical field [0001] The invention belongs to the technical field of thermal transfer film production equipment, and in particular relates to an automatic alignment transfer device for thermal transfer film adapted to flexible substrates. Background technique [0002] Thermal transfer production usually refers to the process of cutting the prepared thermal transfer film and laminating it on the substrate. The industry was originally operated manually, but the disadvantages are obvious, such as low efficiency and poor precision. In addition, there are situations where multiple films are stacked and difficult to separate and transferred together, resulting in serious waste of materials. For this reason, through continuous research and development in the industry, production equipment with a high degree of automation has been designed. [0003] The structure of a type of automatic equipment for thermal transfer film cutting and transfer widely used in the industry is usually...

AI Technical Summary

Problems solved by technology

Of course, although the above mechanisms generally meet the transfer printing requirements of most substrates, and have high precision and reliability, in long-term practice, we still find the following problems: The known substrate positioning of such mechanisms The tabletops are all rigid tabletops, although they have better performance when supporting rigid substrates (plastic sheets, glass plates, etc.) (especially when they ensure a certain surface flatness, they can be pressed with thermal transfer film Produce better stress feedback and improve the bonding effect with the thermal transfer film), but for some flexible substrates (such as PVC sheets, leather sheets, foam soft boards, etc.), they often perform poorly. This is because:

[0006] 1) Due to the lack of sufficient flatness of the flexible substrate itself, when its wrinkled surface is subjected to the pressure of the heat transfer film pressing plate, local cavities are formed due to the bulging of air bubbles, which greatly reduces the gap between the surface of the substrate and the heat transfer film. The matching degree and tightness of the fit, thus affecting the transfer accuracy

[0007] 2) Since the shape of the flexible substrate is easy to change, the bulging part on the surface will stretch around after bearing the pressure of the heat transfer film pressure plate, affecting and changing the surface shape of the substrate, greatly reducing the distance between it and the heat transfer film. The alignment accuracy between them affects the quality of the final transfer product

[0008] 3) In the known mechanism, during the pressing process of the thermal transfer film, the rigid substrate positioning platen cannot effectively fit the thermal transfer film and give it an appropriate feedback force, especially for the surface morphology of the thermal transfer film. Poor, to a certain extent, greatly reduces the bonding force and bonding accuracy between the substrate and the thermal transfer film, affecting the quality of the final product

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