Method for depositing interface layer of transparent conducting thin film on polyester surface through magnetron sputtering
A transparent conductive film, surface deposition technology, applied in sputtering, coating, oxide conductor, etc., can solve the problem of poor adhesion, poor matching between oxide transparent conductive film and flexible polyester substrate, easy to fall off and other problems to achieve the effect of improving adhesion, optical transmittance and electrical conductivity
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Embodiment example 1
[0078] Follow step 1 for flexible transparent F 46 The substrate is cleaned and dried; the dry, clean flexible transparent F 46 Put the substrate into the high-vacuum multifunctional magnetron sputtering chamber, close all valves and windows, and close the baffles directly below all targets, and pump the background vacuum to 2×10 -4 Pa; rotate backsputter baffle to flexible transparent F 46 Directly above the substrate, adjust the distance between the substrate and the reverse sputtering baffle to be 30 mm, the ratio of argon and oxygen to be introduced is 4:1, the total gas flow rate is 13 sccm, the sputtering pressure is 0.3 Pa, and the reverse sputtering power is 15 W. Flexible transparent F 46 The substrate is subjected to reverse sputtering plasma treatment for 60s;
[0079] Flexible transparent F 46 After the plasma treatment of the substrate, the reverse sputtering baffle is rotated away, the target B is selected, the distance between the substrate and the target B ...
Embodiment example 2
[0084] Follow step 1 for flexible transparent F 46 The substrate is cleaned and dried; the dry, clean flexible transparent F 46 Put the substrate into the high-vacuum multifunctional magnetron sputtering chamber, close all valves and windows, and close the baffles directly below all targets, and pump the background vacuum to 5×10 -4 Pa; rotate backsputter baffle to flexible transparent F 46 Directly above the substrate, adjust the distance between the substrate base and the reverse sputtering baffle to be 40mm, the ratio of argon and oxygen to be introduced is 4.5:1, the total gas flow rate is 15sccm, the sputtering pressure is 0.4pa, and the reverse sputtering power is 23W. For flexible transparent F 46 The substrate is subjected to reverse sputtering plasma treatment for 80s;
[0085] Flexible transparent F 46 After the plasma treatment of the substrate, the reverse sputtering baffle is rotated away, the target B is selected, the distance between the substrate and the targ...
Embodiment example 3
[0090] Follow step 1 for flexible transparent F 46 The substrate is cleaned and dried; the dry, clean flexible transparent F 46 Put the substrate into the high-vacuum multifunctional magnetron sputtering chamber, close all valves and windows, and close the baffles directly below all targets, and pump the background vacuum to 8×10 -4 Pa; rotate backsputter baffle to flexible transparent F 46 Directly above the substrate, adjust the distance between the substrate base and the reverse sputtering baffle to be 45mm, the ratio of argon and oxygen to be introduced is 5:1, the total gas flow rate is 18sccm, the sputtering pressure is 0.5pa, and the reverse sputtering power is 30W. For flexible transparent F 46 The substrate is subjected to reverse sputtering plasma treatment for 100s;
[0091] Flexible transparent F 46 After the plasma treatment of the substrate, the reverse sputtering baffle is rotated away, the target B is selected, the distance between the substrate and the tar...
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Abstract
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