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Method for depositing interface layer of transparent conducting thin film on polyester surface through magnetron sputtering

A transparent conductive film, surface deposition technology, applied in sputtering, coating, oxide conductor, etc., can solve the problem of poor adhesion, poor matching between oxide transparent conductive film and flexible polyester substrate, easy to fall off and other problems to achieve the effect of improving adhesion, optical transmittance and electrical conductivity

Inactive Publication Date: 2016-11-09
SHANGHAI JIAO TONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the defects in the prior art, the object of the present invention is to provide a method for depositing a transparent conductive film on the surface of polyester by magnetron sputtering, which effectively solves the problem of mismatching between the oxide transparent conductive film and the flexible polyester substrate. Good, poor adhesion, easy to fall off the key problem, at the same time, effectively improve the photoelectric performance of the inorganic oxide transparent conductive film

Method used

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  • Method for depositing interface layer of transparent conducting thin film on polyester surface through magnetron sputtering
  • Method for depositing interface layer of transparent conducting thin film on polyester surface through magnetron sputtering
  • Method for depositing interface layer of transparent conducting thin film on polyester surface through magnetron sputtering

Examples

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Embodiment example 1

[0078] Follow step 1 for flexible transparent F 46 The substrate is cleaned and dried; the dry, clean flexible transparent F 46 Put the substrate into the high-vacuum multifunctional magnetron sputtering chamber, close all valves and windows, and close the baffles directly below all targets, and pump the background vacuum to 2×10 -4 Pa; rotate backsputter baffle to flexible transparent F 46 Directly above the substrate, adjust the distance between the substrate and the reverse sputtering baffle to be 30 mm, the ratio of argon and oxygen to be introduced is 4:1, the total gas flow rate is 13 sccm, the sputtering pressure is 0.3 Pa, and the reverse sputtering power is 15 W. Flexible transparent F 46 The substrate is subjected to reverse sputtering plasma treatment for 60s;

[0079] Flexible transparent F 46 After the plasma treatment of the substrate, the reverse sputtering baffle is rotated away, the target B is selected, the distance between the substrate and the target B ...

Embodiment example 2

[0084] Follow step 1 for flexible transparent F 46 The substrate is cleaned and dried; the dry, clean flexible transparent F 46 Put the substrate into the high-vacuum multifunctional magnetron sputtering chamber, close all valves and windows, and close the baffles directly below all targets, and pump the background vacuum to 5×10 -4 Pa; rotate backsputter baffle to flexible transparent F 46 Directly above the substrate, adjust the distance between the substrate base and the reverse sputtering baffle to be 40mm, the ratio of argon and oxygen to be introduced is 4.5:1, the total gas flow rate is 15sccm, the sputtering pressure is 0.4pa, and the reverse sputtering power is 23W. For flexible transparent F 46 The substrate is subjected to reverse sputtering plasma treatment for 80s;

[0085] Flexible transparent F 46 After the plasma treatment of the substrate, the reverse sputtering baffle is rotated away, the target B is selected, the distance between the substrate and the targ...

Embodiment example 3

[0090] Follow step 1 for flexible transparent F 46 The substrate is cleaned and dried; the dry, clean flexible transparent F 46 Put the substrate into the high-vacuum multifunctional magnetron sputtering chamber, close all valves and windows, and close the baffles directly below all targets, and pump the background vacuum to 8×10 -4 Pa; rotate backsputter baffle to flexible transparent F 46 Directly above the substrate, adjust the distance between the substrate base and the reverse sputtering baffle to be 45mm, the ratio of argon and oxygen to be introduced is 5:1, the total gas flow rate is 18sccm, the sputtering pressure is 0.5pa, and the reverse sputtering power is 30W. For flexible transparent F 46 The substrate is subjected to reverse sputtering plasma treatment for 100s;

[0091] Flexible transparent F 46 After the plasma treatment of the substrate, the reverse sputtering baffle is rotated away, the target B is selected, the distance between the substrate and the tar...

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Abstract

The invention provides a method for depositing an interface layer of a transparent conducting thin film on a polyester surface through magnetron sputtering. The method comprises following steps: firstly, re-sputtering in a magnetron sputtering machine is adopted to carry out plasma surface treatment on a polyester substrate, a large number of suspension bonds are generated, and meanwhile surface roughness is increased; secondly, a B2O3 nano modification layer grows on the surface of the polyester substrate obtained after plasma treatment; and S3, the transparent conducting thin film grows on the B2O3 nano modification layer again. The technology for depositing the interface layer of the transparent conducting thin film on the polyester surface through magnetron sputtering obviously improves adhesive force between the transparent conducting thin film and the polyester substrate, and meanwhile, the optical transmission and the conducting performance of the transparent conducting film are improved to a certain degree.

Description

technical field [0001] The invention relates to flexible optoelectronic devices such as flexible display touch screens, display materials, solar cells, and satellite thermal control materials antistatic secondary surface mirrors. Specifically, it relates to a method for depositing transparent conductive films on polyester surfaces by magnetron sputtering Interface layer method. Background technique [0002] With the development of electronic devices and electronic products in the direction of miniaturization and portability, various types of touch screens, displays, solar cells, optoelectronic devices and flexible antistatic secondary surface mirrors grown on flexible organic substrates have: such as light weight , Strong impact resistance, bendable, and can use the efficient roll-to-roll method to continuously produce films of various sizes and shapes. [0003] After searching the existing technologies, most of the technologies use inks prepared from various conductive sub...

Claims

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Application Information

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IPC IPC(8): C23C14/08C23C14/35C23C14/02H01B1/08
CPCC23C14/0036C23C14/021C23C14/022C23C14/024C23C14/08C23C14/086C23C14/35H01B1/08
Inventor 张亚非刘刚王惠芬马德福苏言杰
Owner SHANGHAI JIAO TONG UNIV