Anti-magnetic heat-conducting film and preparation method thereof

A heat-conducting film and heat-conducting layer technology, applied in chemical instruments and methods, coatings, layered products, etc., can solve problems such as poor heat dissipation

Inactive Publication Date: 2016-11-16
胡银坤
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The antimagnetic thin film materials currently on the market generally have the problem of poor heat dissipation

Method used

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  • Anti-magnetic heat-conducting film and preparation method thereof

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preparation example Construction

[0043] The present invention also provides a method for preparing a diamagnetic heat-conducting film, comprising the following steps:

[0044] A) one side of the substrate is coated with antistatic glue, and cured to obtain a substrate compounded with an antistatic layer;

[0045] B) attaching a peeling film on the surface of the antistatic layer to form the first peeling layer;

[0046] C) plating a layer of metal on the other side of the substrate to form a metal layer;

[0047] D) Coating heat-conducting glue on the surface of the metal layer, and obtaining a heat-conducting layer after curing, heat-conducting particles are dispersed in the heat-conducting glue, and the heat-conducting particles include alumina particles, aluminum hydroxide particles, boron nitride particles and copper-zinc alloy particles one or more of them;

[0048] E) Attaching a release film on the surface of the heat conduction layer to obtain a diamagnetic heat conduction film.

[0049]The present...

Embodiment 1

[0058] On the 50μm thick PET insulating film, apply a 4μm thick antistatic glue with a micro concave roller, and cure it with a UV lamp to obtain an antistatic layer;

[0059] Take a PET film with a thickness of 50 μm, and apply a layer of 10 μm silica gel on one side with a comma-type spatula. After baking and curing, cover the side with the glue on the surface of the antistatic layer to form a peeling layer;

[0060] Plating a layer of metal copper with a thickness of 500nm on the other side of the PET insulating film by sputtering to form a metal layer;

[0061] Coating a layer of thermally conductive adhesive on the surface of the copper metal layer, baking and curing to form a 10 μm thick thermally conductive layer, and finally covering a layer of 50 μm thick release film to obtain a diamagnetic thermally conductive film.

Embodiment 2

[0063] Apply 5 μm thick antistatic glue on the 50 μm thick PET insulating film with a micro concave roller, and cure it with a UV lamp to obtain an antistatic layer;

[0064] Take a PET film with a thickness of 50 μm, and apply a layer of 10 μm silica gel on one side with a comma-type spatula. After baking and curing, cover the side with the glue on the surface of the antistatic layer to form a peeling layer;

[0065] A layer of 300nm thick metal copper is plated on the other side of the PET insulating film by sputtering to form a metal layer;

[0066] Coating a layer of thermally conductive adhesive on the surface of the copper metal layer, baking and curing to form a 25 μm thick thermally conductive layer, and finally covering a layer of 50 μm thick release film to obtain a diamagnetic thermally conductive film.

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Abstract

The invention provides an anti-magnetic heat-conducting film which comprises a first stripping layer, an antistatic layer compounded on the first stripping layer, a base material layer compounded on the antistatic layer, a metal layer compounded on the base material layer, a heat-conducting layer compounded on the metal layer, and a second stripping layer compounded on the heat-conducting layer, wherein heat-conducting particles are dispersed inside the heat-conducting layer, and comprise one or several of aluminum oxide particles, aluminum hydroxide particles, boron nitride particles and copper zinc alloy particles. According to the anti-magnetic heat-conducting film provided by the invention, the metal layer and the heat-conducting layer are simultaneously arranged, the heat-conducting particles are dispersed inside the heat-conducting layer, magnetism can be effectively resisted while matching with the metal layer, and heat generated on electronic components or electronic equipment can be rapidly transferred, so that an effect of protecting the electronic components and equipment is achieved. The invention also provides a method for preparing the anti-magnetic heat-conducting film.

Description

technical field [0001] The invention belongs to the technical field of polymer film materials, and in particular relates to a diamagnetic heat-conducting film and a preparation method thereof. Background technique [0002] At present, the heating problem of electronic components or electronic equipment has always been a matter of great concern to manufacturers and users. Overheating of electronic components / equipment will accelerate the loss of life of electronic components and cause safety hazards to equipment. At the same time, electromagnetic radiation and interference are also important factors that affect the sensitivity of electronic components and the health of users. The antimagnetic thin film materials currently on the market generally have the problem of poor heat dissipation. Contents of the invention [0003] The object of the present invention is to provide a diamagnetic heat-conducting film and a preparation method thereof. The diamagnetic heat-conducting f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/28B32B27/36B32B27/06B32B33/00
CPCB32B27/281B32B27/06B32B27/36B32B33/00B32B2255/10B32B2255/205B32B2255/26B32B2264/10B32B2264/102B32B2264/105B32B2307/212
Inventor 胡银坤
Owner 胡银坤
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