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Production process of ceramic cover plate

A preparation process and ceramic cover technology, which is applied in the field of ceramic cover plate preparation process for microwave packaging, can solve the problems of low dimensional accuracy of finished products, deformation, and inability to fire qualified products, etc., so as to improve yield rate and product accuracy, and improve sealing sexual effect

Active Publication Date: 2016-11-16
FOSHAN HUAZHI ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the ceramic cover plate made by dry pressing method is very easy to crack during sintering, and the yield is low, and the dimensional accuracy of the fired product is not high.
(2) Traditional ceramics use the grouting method to make flat thin-walled ceramic parts such as ceramic cover plates. Although the molding precision is high, the deformation is serious during sintering, and qualified products cannot be fired.

Method used

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  • Production process of ceramic cover plate
  • Production process of ceramic cover plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] 1. Weighing: The solid raw material is 92% alumina, 3% calcium oxide, 2% magnesium oxide, 2% silicon dioxide, 0.5% nickel, 0.2% La 2 o 3 and 0.3% are weighed respectively by proportioning;

[0052] 2. Ball milling: Mix the solid raw materials evenly before ball milling to ensure that the mesh size of the mixed powder after ball milling is within the range of 3000-4000 mesh;

[0053] 3. Mixing: mix the mixed powder after ball milling with the organic solvent in a ratio of 1:1 by weight to form a slurry; wherein, the organic solvent is ethanol: methyl ethyl ketone = 1:1.5.

[0054] 4. Molding: According to the product requirements, make a ceramic cover plate mold and a ceramic base mold, inject the slurry pressurized to 0.3MPa into the ceramic cover plate mold and the ceramic base mold respectively, and obtain a ceramic cover plate blank and a ceramic base body;

[0055] 5. Assembly: After covering the ceramic base body with a layer of 0.5mm thick adhesive powder, the...

Embodiment 2

[0060] 1. Weighing: The solid raw material is 88% alumina, 3% calcium oxide, 4% magnesium oxide, 3% silicon dioxide, 0.3% molybdenum, 0.7% iron and 1% Ce 2 o 3 Weigh separately according to the proportion;

[0061] 2. Ball milling: Mix the solid raw materials evenly before ball milling to ensure that the mesh size of the mixed powder after ball milling is within the range of 2000-4000 mesh;

[0062] 3. Mixing: mix the mixed powder after ball milling with organic solvent in a ratio of 1:1.5 by weight to form a slurry; wherein, the organic solvent is ethanol:trichloroethylene=1:2.

[0063] 4. Molding: According to the product requirements, make a ceramic cover mold and a ceramic base mold, inject the slurry pressurized to 0.4MPa into the ceramic cover mold and the ceramic base mold respectively, and obtain a ceramic cover plate body and a ceramic base body;

[0064] 5. Assembly: After covering the ceramic base body with a layer of 0.3mm thick adhesive powder, then assemble th...

Embodiment 3

[0069] 1. Weighing: the solid raw material is 90% alumina, 5% calcium oxide, 3% magnesium oxide, 1% silicon dioxide, 0.2% titanium, 0.5% ZrO 2 and 0.3%CeO 2 Rare earth metal oxides are weighed respectively according to the proportioning ratio;

[0070] 2. Ball milling: After mixing the solid raw materials evenly, carry out ball milling to ensure that the mesh number of the mixed powder after ball milling is within the range of 2000-2500 mesh;

[0071] 3. Mixing: mix the mixed powder after ball milling with organic solvent in a weight ratio of 1:2 to form a slurry; among them, the organic solvent is ethanol:toluene=1:1.

[0072] 4. Molding: According to the product requirements, make a ceramic cover mold and a ceramic base mold, inject the slurry pressurized to 0.5MPa into the ceramic cover mold and the ceramic base mold respectively, and obtain a ceramic cover plate body and a ceramic base body;

[0073] 5. Assembly: After covering the ceramic base body with a layer of 0.6m...

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Abstract

The present invention discloses a production process of a ceramic cover plate, comprising the following steps of weighing: weighing solid materials respectively according to a ratio; ball milling: mixing well the solid materials, and ball-milling; mixing: mixing the ball-milled mixed power and an organic solvent according to a weight ratio of 1:(1-3) to obtain a slurry; forming: injecting the slurry respectively into a ceramic cover plate mold and a ceramic base mold, and forming to obtain a ceramic cover plate blank and a ceramic base blank; assembling: after covering the ceramic base blank with a layer of anti-adhesion powder, and assembling the ceramic cover plate blank and the ceramic base blank; sintering: placing the assembled ceramic cover plate blank and ceramic base blank in a sintering furnace, sintering at 1300-1600 DEG C for 5-20 hours to obtain the ceramic cover plate and a ceramic base; and deburring the ceramic cover plate to obtain a product. By using the production process, the product rarely deforms during sintering, product yield is increased, production cost is reduced, and product dimensional accuracy is improved.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a preparation process for a ceramic cover plate used for microwave packaging. Background technique [0002] In recent years, high-frequency microwave technology has been widely and important used in systems such as communication, navigation, satellite, bluetooth, and sensory Internet of Things radio frequency technology. The packaging design of RF / microwave devices is very important. The packaging can protect the device and also affect the performance of the device. Therefore, the package must be able to provide excellent electrical properties, device protection and shielding, and so on. High-performance RF microwave devices usually use ceramic packaging materials. The dielectric properties of ceramic materials are stable in a wide range of temperature and frequency, and can withstand high processing and operating temperatures. They have excellent mechanical propert...

Claims

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Application Information

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IPC IPC(8): C04B35/10C04B35/622
CPCC04B35/10C04B35/622C04B2235/3206C04B2235/3208C04B2235/3227C04B2235/3229C04B2235/3418C04B2235/404C04B2235/405
Inventor 马文珍戴高环
Owner FOSHAN HUAZHI ADVANCED MATERIALS CO LTD
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