Consumer electronic panel machining process based on sapphire technology

A technology for consumer electronics and panel processing. It is applied in the direction of chassis/cabinet/drawer parts, etc. It can solve the problems of poor yield, difficult processing of large-screen sapphire panels, and low efficiency, and improve product strength and appearance. Good quality, improved thermal stress effect

Inactive Publication Date: 2016-11-23
成都市思卡利科技有限公司
View PDF1 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a consumer electronics panel processing technology based on sapphire technology, aiming at the defects of large-screen sapphire panel proces

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A consumer electronics panel processing technology based on sapphire technology, which provides a new processing technology for the existing large-screen sapphire panel processing difficulties, low efficiency, and poor yield, especially for processing 2.5D arc-edge contour resistance Abrasion and scratch-resistant consumer electronics panels, especially adopt the following setting methods: use cutting technology, tree technology and surface treatment technology to process sapphire materials into consumer electronics panels. Consumer electronics panels include mobile phone panels and tablet computer panels.

Embodiment 2

[0038] This embodiment is further optimized on the basis of the above-mentioned embodiments. In order to better realize the present invention, the following setting method is adopted in particular: the processing technology of the consumer electronics panel includes and the specific process flow:

[0039] 1) The sapphire is cut from the bar into pieces: the sapphire after quality inspection is cut into blocks, and then the blank margin is 0.15mm~0.2mm unilaterally refined according to the size of the consumer electronics panel, and the block corresponds to the panel The edges of the four corners are rounded, and the size of the rounded corners is 4.5~8R; then the block is cut into pieces by wire cutting equipment;

[0040] 2) Use a double-sided copper disc machine to grind and thin the sheet material on both sides to obtain a thinned panel sheet material. Among them, the unit surface pressure of the grinding machine and the upper plate is controlled at: 0.028kg / cm 2 , combined...

Embodiment 3

[0046]This embodiment is further optimized on the basis of any of the above-mentioned embodiments. In order to better realize the present invention, the following setting method is adopted in particular: the step 2) is specifically: using 2.5 μm diamond liquid, upper and lower The disk speed ratio is 3 / 10, the pressure is controlled at 200kg, the thickness of the thinned panel sheet is controlled at ±0.01mm, TTV≤8μm, WARP≤8μm, and Ra is 360nm.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Login to view more

Abstract

The invention discloses a consumer electronic panel machining process based on a sapphire technology. A consumer electronic panel is machined using a cutting process, a tree process and a surface treatment process. Consumer electronic panels comprise mobile phone panels and tablet computer panels. The machining process comprises the following steps: cutting sapphire after quality inspection into a block, finishing blank allowance of 0.15-0.2mm according to the single-side size of a consumer electronic panel, and rounding the edges of the block corresponding to the four corners of the panel, wherein the fillet dimension is 4.5-8R; and then, cutting the block into a piece through linear cutting equipment. In view of the defects of the existing large-screen sapphire panel, such as high processing difficult, low efficiency and poor yield, a novel machining process is provided, which can be used to machine a 2.5D consumer electronic panel with a wear-resistant and scratch-resistant arc edge contour.

Description

technical field [0001] The invention relates to the technical field of processing technology, in particular to a processing technology for consumer electronics panels based on sapphire technology. Background technique [0002] Sapphire is a general term for corundum gemstones of other colors except ruby ​​(Ruby), and its main component is aluminum oxide (Al2O3). Blue sapphire is caused by a small amount of titanium (Ti) and iron (Fe) impurities mixed in it; the color of sapphire can be pink, yellow, green, white, or even multiple colors in the same stone. The origin of sapphire is found in Thailand, Sri Lanka, Madagascar, Laos, Cambodia, Changle, Shandong, Hainan, and the stalagmite mountain in Jiangjin, Chongqing. The rarest origin should belong to the sapphire in Kashmir, and Myanmar is the top sapphire produced today. most places. [0003] The biggest feature of sapphire is uneven color, which can be seen in parallel hexagonal cylinders, straight color bands and growth ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K5/02
CPCH05K5/02
Inventor 姜迪蛟
Owner 成都市思卡利科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap