A kind of preparation method of low dielectric, high toughness epoxy resin cured product
A technology of epoxy resin curing and high toughness, which is used in the preparation of epoxy resin cured products, and can solve the problems of low dielectric, high dielectric constant and poor toughness.
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specific Embodiment approach 1
[0037] Specific embodiment one: the preparation method of low dielectric, high toughness epoxy resin cured product of this embodiment, carry out according to the following steps:
[0038] 1. Synthesis of FCBHBP:
[0039] Add pentaerythritol and dimethylolpropionic acid to the three-necked flask of the reaction device, and add p-toluenesulfonic acid, raise the temperature to 120-125°C, keep it warm for 0.5-1h, then raise the temperature to 140-145°C, keep it warm for 2-2.5h, then Vacuum dehydration for 30-40min under vacuum degree of 0.08-0.09MPa, add flexible chain end-capping agent, keep warm at 170-200°C for 4-7h, cool down, discharge, and obtain flexible chain-capped hyperbranched polyester resin FCBHBP ;
[0040] 2. Preparation of cured product of FCBHBP modified epoxy anhydride resin
[0041] Epoxy resin, acid anhydride curing agent and pyridine are mixed evenly according to the mass ratio of 100:70:0.47, and the FCBHBP prepared in step 1 is added. Foam, pour into the ...
specific Embodiment approach 2
[0042] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the molar ratio of pentaerythritol and dimethylolpropionic acid described in step one is 1:4. Others are the same as in the first embodiment.
specific Embodiment approach 3
[0043] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the quality of p-toluenesulfonic acid in step 1 is 0.5% to 2% of the total mass of pentaerythritol and dimethylolpropionic acid. Others are the same as in the first or second embodiment.
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Abstract
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