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A kind of preparation method of low dielectric, high toughness epoxy resin cured product

A technology of epoxy resin curing and high toughness, which is used in the preparation of epoxy resin cured products, and can solve the problems of low dielectric, high dielectric constant and poor toughness.

Inactive Publication Date: 2018-06-29
HARBIN UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problems of high dielectric constant and poor toughness of existing epoxy resins, and provides a method for preparing cured epoxy resins with low dielectric constant and high toughness

Method used

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  • A kind of preparation method of low dielectric, high toughness epoxy resin cured product
  • A kind of preparation method of low dielectric, high toughness epoxy resin cured product
  • A kind of preparation method of low dielectric, high toughness epoxy resin cured product

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specific Embodiment approach 1

[0037] Specific embodiment one: the preparation method of low dielectric, high toughness epoxy resin cured product of this embodiment, carry out according to the following steps:

[0038] 1. Synthesis of FCBHBP:

[0039] Add pentaerythritol and dimethylolpropionic acid to the three-necked flask of the reaction device, and add p-toluenesulfonic acid, raise the temperature to 120-125°C, keep it warm for 0.5-1h, then raise the temperature to 140-145°C, keep it warm for 2-2.5h, then Vacuum dehydration for 30-40min under vacuum degree of 0.08-0.09MPa, add flexible chain end-capping agent, keep warm at 170-200°C for 4-7h, cool down, discharge, and obtain flexible chain-capped hyperbranched polyester resin FCBHBP ;

[0040] 2. Preparation of cured product of FCBHBP modified epoxy anhydride resin

[0041] Epoxy resin, acid anhydride curing agent and pyridine are mixed evenly according to the mass ratio of 100:70:0.47, and the FCBHBP prepared in step 1 is added. Foam, pour into the ...

specific Embodiment approach 2

[0042] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the molar ratio of pentaerythritol and dimethylolpropionic acid described in step one is 1:4. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0043] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the quality of p-toluenesulfonic acid in step 1 is 0.5% to 2% of the total mass of pentaerythritol and dimethylolpropionic acid. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a preparing method for cured epoxy resin, in particular to a preparing method for low-dielectric and high-toughness cured epoxy resin. The preparing method aims at solving the problems that existing epoxy resin is high in dielectric constant and poor in toughness. The method comprises the steps that firstly, pentaerythritol and dimethylolpropionic acid are added in a reaction device three-opening bottle, p-toluenesulfonic acid is added, heating is carried out, the temperature is maintained for 0.5-1 h, heating and temperature maintaining are carried out again, then vacuum dewatering is carried out, a flexible chain end capping agent is added, the temperature is maintained, cooling is carried out, discharging is carried out, and flexible chain terminated hyperbranched polyester resin FCBHBP is obtained; secondly, epoxy resin, an anhydride curing agent and pyridine are mixed evenly, FCBHBP is added and stirred evenly, decompression defoaming is carried out, the mixture is poured into a mold, and curing is carried out. FCBHBP can improve the toughness of the epoxy resin through the double effects of free volume increasing and chain segment winding, and the impact strength and bending strength of the epoxy resin are remarkably improved; meanwhile, loss can be reduced within certain frequency through the interaction of flexible chains and polar functional groups in epoxy resin. The preparing method is applied to the filed of epoxy resin curing.

Description

technical field [0001] The invention relates to a preparation method of cured epoxy resin. Background technique [0002] Epoxy resin refers to a class of organic polymer compounds containing two or more epoxy groups in the molecule, a polymer prepolymer with aliphatic, alicyclic or aromatic segments as the main chain, generally they The relative molecular mass is not large. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or ring structure of the molecular chain. Since the molecular structure contains active epoxy groups, they can cross-link with various types of curing agents to form insoluble, infusible three-dimensional network structure polymers. [0003] Epoxy resin is the most widely used general-purpose thermosetting matrix resin. Epoxy resin has the characteristics of excellent adhesion, low cure shrinkage, high mechanical strength and easy processing. It is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G63/60C08G63/91C08G59/58C08L63/00C08L67/00
CPCC08G59/58C08G63/60C08G63/91C08L63/00C08L2203/20C08L67/00
Inventor 刘立柱周佩君张笑瑞温带军王芳钟伟平
Owner HARBIN UNIV OF SCI & TECH