A kind of snbisb series low-temperature lead-free solder and preparation method thereof

A technology of lead-free solder and lead-free solder alloy, which is applied in welding equipment, welding/cutting media/materials, manufacturing tools, etc. It can solve problems such as deformation, SnBi solder brittleness and poor reliability, and low melting point of alloys. Small size, share the stress together, and increase the electrode potential

Active Publication Date: 2019-03-12
BEIJING COMPO ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the weak point that exists in the prior art, provide a kind of novel SnBiSb-X lead-free solder alloy of low-temperature soldering field, this alloy melting point is low, and this solder can fundamentally solve the brittleness of SnBi solder and poor reliability
At the same time, the SnBiSb-X solder alloy can solve a series of welding quality problems caused by warping, deformation and pillows of the welded parts such as microchips, BGAs, and CSPs caused by high temperature during the welding process.

Method used

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  • A kind of snbisb series low-temperature lead-free solder and preparation method thereof
  • A kind of snbisb series low-temperature lead-free solder and preparation method thereof
  • A kind of snbisb series low-temperature lead-free solder and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0035] A lead-free solder alloy used in the field of low-temperature soldering. In terms of weight percentage, the lead-free solder alloy powder includes: Bi 41.8%, Sb 2.1%, and the rest are Sn and unavoidable impurities. The lead-free solder alloy is nearly Pereutectic structure, the melting point of the alloy is 142.9-150.8°C. The method for preparing the lead-free solder alloy comprises the following steps:

[0036] 1) Add metal Bi and Sb with a purity of 99.99wt.% into the vacuum melting furnace at an alloy ratio of 80:20 by weight, and vacuumize to 1×10 -1 Pa, filled with nitrogen; heat the alloy to 650-700 ° C to melt, and at the same time, add electromagnetic stirring to make the alloy composition uniform, and then vacuum cast to prepare the Bi-Sb20 master alloy;

[0037] 2) The prepared Bi-Sb master alloy and metals Sn and Bi are melted in a melting furnace according to the alloy ratio. Cover the surface of the alloy with an anti-oxidation solvent, the anti-oxidation...

Embodiment 2

[0039] A lead-free solder alloy used in the field of low-temperature soldering. In terms of weight percentage, the lead-free solder alloy powder includes: Bi 50%, Sb 1.0%, and the rest are Sn and unavoidable impurities. The lead-free solder alloy is composed of Eutectic structure with a melting point of 140.6-143.8°C. The method for preparing the lead-free solder alloy is the same as that in Example 1 except that the alloy ratio is different.

[0040] Such as figure 1 Shown is the SEM photo of the structure of the solder alloy prepared in this embodiment, and it can be seen from the figure that the alloy is an eutectic structure.

Embodiment 3

[0042] A lead-free solder alloy for low-temperature soldering field, the lead-free solder alloy powder contains: Bi 55%, Sb 0.8%, Ce 0.01%, Ti 0.05%, and the rest is Sn and unavoidable impurities , the lead-free solder alloy has a near-eutectic structure and a melting point of 142.9-146.2°C. The method for preparing the lead-free solder alloy comprises the following steps:

[0043] 1) Add metal Bi and Sb with a purity of 99.99wt.% into the vacuum melting furnace at an alloy ratio of 80:20 by weight, and vacuumize to 1×10 -2 Pa, filled with nitrogen, heated to 650-700 ° C to melt, and at the same time, electromagnetically stirred to make the alloy composition uniform, and then vacuum cast to prepare a Bi-Sb20 master alloy;

[0044] 2) Metals Sn and Ce, Sn and Ti with a purity of 99.99wt.% were added to the vacuum melting furnace according to a certain alloy ratio, and the vacuum treatment was carried out to 1×10 -2 Pa, filled with nitrogen; heat the alloy to 690-780°C and 155...

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Abstract

The invention discloses a SnBiSb low-temperature lead-free solder and a preparation method thereof, belonging to the technical field of low-temperature solder. The weight percentage composition of this lead-free solder is: Bi 32.8-56.5%, Sb 0.7-2.2%, the rest is Sn, and the weight percentage of Bi and Sb satisfies the relationship b=0.006a 2 ‑0.672a+19.61+c, wherein a is the weight percentage of Bi, b is the weight percentage of Sb, and the range of c is ‑1.85≤c≤1.85. The invention also discloses a preparation method of the lead-free solder. The solder alloy of the invention is a pereutectic or near-eutectic structure, has a low melting point, has excellent mechanical properties and reliability, and is suitable for the field of low-temperature soldering.

Description

technical field [0001] The invention relates to a SnBiSb-based low-temperature lead-free solder and a preparation method thereof, in particular to a SnBiSb-X lead-free solder alloy used in the field of low-temperature soldering and a preparation method thereof, belonging to the technical field of low-temperature solder. Background technique [0002] With the rapid development of lead-free electronic products and the direction of light, thin and high-function, the lead-free solder SnAgCu series (especially SAC305) mainly used in SMT at present, due to the high melting point of solder (200 ℃ ~ 230 ℃), reflow The new thin, light and tiny chips in the soldering process are very sensitive to temperature, and the common BGA components such as Head-On-Pillow (HoP), SolderBridCu Defect, Stretched Joint, Non-Contact Open (NCO) in the SMT process are caused by high temperature during soldering. The problem of solder joint defects is becoming more and more prominent, so the market dema...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26C22C1/03C22C13/02C22C12/00
CPCB23K35/264C22C1/03C22C12/00C22C13/02B23K35/26B23K35/262
Inventor 贺会军孙彦斌刘希学王志刚胡强安宁张品张富文张江松
Owner BEIJING COMPO ADVANCED TECH
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