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High-throughput composed material chip and preparation method and device thereof

A technology of combining material chips and preparation devices, applied in metal material coating process, vacuum evaporation plating, coating and other directions, can solve problems such as low preparation efficiency, achieve high-efficiency preparation, improve preparation efficiency, widen application range and Effects in the field of application

Active Publication Date: 2016-12-14
成都芯曌科技有限公司
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Problems solved by technology

[0004] In order to overcome the technical problem of low preparation efficiency of existing high-throughput combined material chips, the present invention provides a high-throughput combined material chip and its preparation method and preparation device

Method used

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  • High-throughput composed material chip and preparation method and device thereof
  • High-throughput composed material chip and preparation method and device thereof
  • High-throughput composed material chip and preparation method and device thereof

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Embodiment Construction

[0026] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] see figure 1 and figure 2 The first embodiment of the present invention provides a high-throughput combined material chip preparation device 1, which includes a transition chamber 11, a feeding module 12, a preparation chamber 13, an evaporation module 14, an evaporation boat 15, an adjustment module 16, The first formwork module 17 , the second formwork module 18 , and the carrying mechanism 19 . The transition chamber 11 is disposed between the preparation chamber 13 and the external device 10 connected to the transition chamber 11, and is used to form a channel for doc...

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Abstract

The invention relates to a preparation device of a high-throughput composed material chip. The preparation device comprises a preparation cavity, a raw material output device stretching into the preparation cavity, an evaporator module contained in the preparation cavity, a plurality of discrete masks and a continuous mask. The raw material output device is arranged between the evaporator module and the discrete masks / continuous mask and used for quantitatively supplying raw materials to the evaporator module when the air pressure in the raw material output device is the same as that in the preparation cavity. The evaporator module is used for evaporating the raw materials supplied by the raw material output device so that steam can be formed. The steam is deposited on a substrate through the discrete masks and / or the continuous mask, so that the high-throughput composed material chip is formed. The invention further relates to a preparation method of the high-throughput composed material chip adopting the preparation device and the high-throughput composed material chip prepared through the preparation method. According to the preparation device of the high-throughput composed material chip, the raw materials can be supplemented to the evaporator module without destroying the working air pressure, and thus the preparation efficiency of the chip can be improved.

Description

【Technical field】 [0001] The invention relates to the technical field of composite material chips, in particular to a high-throughput composite material chip, a preparation method and a preparation device thereof. 【Background technique】 [0002] Electron beam evaporation coating technology uses the cooperation of electromagnetic field to accurately realize the use of high-energy electrons to bombard the raw materials in the crucible, make them melt and evaporate and deposit on the substrate to form a coating. The traditional electron beam evaporation coating technology can prepare thin film materials with high purity and high precision. This technology can be used in the preparation of composite material chips, which can greatly increase the preparation and screening speed of new materials. Efficient means of material theory research such as synthesis process and verification theory research and calculation. At the same time, compared with other vacuum coating technologies,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/30
CPCC23C14/30
Inventor 闫宗楷向勇彭志蒋赵联李响
Owner 成都芯曌科技有限公司
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