An Improved Intensive Wet Process Equipment

Abstract

The invention discloses improved intensive-type wet process equipment, and the equipment comprises main equipment and a liquid medicine adding groove. The main equipment comprises an equipment main body and a support mechanism, and the distance between the support mechanism and the ground is set as a specific value, so as to enable the interior of the support mechanism to have a communicated accommodation space for accommodating the liquid medicine adding groove, a water incoming pipe and a water drainage pipe. A liquid medicine adding device above the equipment main body comprises a jigger and an adding pump, wherein one side wall of the jigger is provided with a medicine inlet and is connected with the adding pump. The bottom of the jigger is provided with a medicine outlet which is communicated with a chemical main groove. The interior of the jigger is also provided with an overflow pipe, wherein the length of the overflow pipe can be adjusted in a vertical direction, and the lower end face of the overflow pipe is communicated with the liquid medicine adding groove. The accommodation space is disposed below the main equipment, thereby avoiding the tedious disassembly and transportation troubles, protecting parts from being lost or damaged, and improving the assembling efficiency. Moreover, the adding amount is precisely adjusted through the adjustment of the length of the overflow pipe, and the accuracy of the adding amount is guaranteed.

Description

technical field [0001] The invention relates to a wet process equipment, in particular to an intensive wet process equipment with an improved structure of a liquid medicine adding device, improved assembly efficiency, and convenient transportation, belonging to the technical field of wet process equipment. Background technique [0002] Wet Process (Wet Process), as a production process in the process of making circuit boards, is to spray processing liquids, such as various chemical liquids or water, on the surface of circuit substrates to achieve desmear, chemical copper, plated through holes, etching, Processes such as development, film stripping, organic protective film coating, surface modification or cleaning. [0003] At present, the wet process is widely used in the production and manufacturing of the printed circuit board PCB industry. The wet process mainly includes the production process of chemical pretreatment, electroplating, development, etching, and film remova...

AI Technical Summary

Problems solved by technology

When the concentration of the chemical solution in the chemical main tank is lower than a certain concentration, the adding pump will deliver the chemical solution to the chemical main tank, but see Figure 3-4 As shown, the medicine adding tank 1' in the existing equipment has a certain distance from the chemical main tank 10a', and long-distance transportation will cause the actual addition amount and the set addition amount delivered by the addition pump 101' to the metering cup 102' to exist. A certain error, so it is necessary to regularly adjust the parameters of the adding pump, that is, regular calibration, to achieve an accurate amount of addition, but this operation is cumbersome, time-consuming and laborious

Moreover, the addition pump 101' needs to cooperate with the bottom valve 105' and the check valve 106' to realize that the pipeline is filled with liquid medicine, such as the cooperation of the bottomless valve 105' and the check valve 106', the check function cannot be realized, and the addition of There may be gas in the pipeline, which will also cause inaccurate dosage

Furthermore, because there is a certain error between the actual amount added and the set amount added, if there is too much liquid medicine to be measured, it can only be added in excess, and it cannot flow back to the liquid medicine adding tank at all.

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