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semiconductor module

A semiconductor and wiring layer technology, applied in the field of semiconductor modules, can solve the problems of large main circuit inductance, insufficient low inductance, and inability to suppress surges, etc.

Active Publication Date: 2018-10-23
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the semiconductor module disclosed in Patent Document 1, even if the distance between the input and output terminals and the control board and the distance between the control terminals and the control board are minimized, it does not take into account the distance between the input and output terminals and the input Distance between output terminal and control terminal, etc.
For example, if the distance between the positive terminal and the negative terminal as the main terminal corresponding to the input terminal for current input among the input and output terminals is long, the inductance of the main circuit will increase.
In addition, if the distance between the main terminal and the AC input terminal connected to a load such as a motor corresponding to the output terminal among the input and output terminals is long, this path becomes a source of noise.
Furthermore, these are the main factors, and the low inductance of the large current path for supplying current to the load becomes insufficient, and the surge accompanying high-speed operation cannot be suppressed.
In addition, for example, if the distance between the input / output terminal and the control terminal is short, an error may occur due to a surge, and the semiconductor switching element may be turned on or off (hereinafter referred to as erroneous turn-on or erroneous turn-off) to malfunction.

Method used

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no. 1 Embodiment approach

[0068] A first embodiment of the present disclosure will be described. In this embodiment, as an application example of the semiconductor module according to one embodiment of the present disclosure, for example, a semiconductor module included in a three-phase inverter circuit that drives a three-phase AC motor or the like is cited and described.

[0069] First, refer to figure 1 , the configuration of the three-phase inverter circuit 1 included in the semiconductor module will be described. Such as figure 1 As shown, a three-phase converter circuit 1 is used to drive a load 3 of a three-phase AC motor based on a DC power source (external power source) 2 . The smoothing capacitor 4 is connected in parallel to the three-phase converter circuit 1 to reduce switching fluctuations, suppress the influence of noise, and form a constant power supply voltage.

[0070] The three-phase converter circuit 1 adopts a configuration in which the upper and lower arms 51 to 56 connected in...

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Abstract

The semiconductor module has three-phase upper branches (51, 53, 55) and lower branches (52, 54, 56), cooling plates (11, 12), main circuit side busbars, output terminal side busbars, control terminals (14 ), and the resin molded part (18). The output terminal side bus bar has U-phase to W-phase wiring layers (133-135) stacked and arranged to face each other with an insulating layer (130) interposed therebetween, and a connection between each of the U-phase to W-phase wiring layers and a load. U-W terminals (13c-13e) for electrical connection. The stacked numbers of the above-mentioned U-phase to W-phase wiring layers are made to be even numbers.

Description

[0001] Cross-references to related applications [0002] This indication is based on the Japanese application number 2014-91148 for which it applied on April 25, 2014, and uses the description content here. technical field [0003] The present disclosure relates to a semiconductor module including a semiconductor switching element. Background technique [0004] Patent Document 1 proposes a structure capable of reducing the influence of noise in a power conversion device including a semiconductor module. In this power conversion device, a structure is adopted in which the input / output terminals drawn from the semiconductor module, the control terminals, and the control board are connected with the shortest distance. Thereby, the inductance of the main circuit (main circuit inductance) via the input / output terminal and the control terminal path inductance via the control terminal can be reduced, and the influence of noise can be reduced. [0005] However, in the semiconducto...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M7/00H01L23/367H01L23/498H01L25/07H01L23/492H01L23/488H01L23/31H01L23/04H01L25/18
CPCH02M7/48H02M7/003H01L2924/181H01L2224/48247H01L2224/73265H01L2924/00014H01L23/051H01L23/3107H01L23/367H01L23/3735H01L23/4334H01L23/5385H01L23/13H01L23/5383H01L23/5384H01L24/48H01L25/072H01L25/18H01L2224/32225H01L2224/8384H01L2224/33181H01L2224/73215H01L2224/29034H01L24/29H01L24/32H01L24/33H01L2224/2612H01L2224/0603H01L2924/00012H01L2224/32245H01L2924/00H01L2224/05599H01L2224/45099H01L2224/85399H01L23/04H01L23/3121H01L23/3675H01L23/492H01L23/49838H01L2224/48091H01L2224/48106H01L2924/1203H01L2924/13055H01L2924/13091H02M7/5387H02P27/06
Inventor 石野宽渡边友和
Owner DENSO CORP
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