Array substrate and manufacturing method thereof and liquid crystal display panel

Abstract

The invention provides a manufacturing method of an array substrate. The method comprises the following steps of sequentially manufacturing a first metal layer, an insulating layer, an active layer and a second metal layer on the substrate; manufacturing a transparent conductive film on the substrate and covering the second metal layer by the transparent conductive film; coating the transparent conductive film with a third photoresist and covering a third mask on the third photoresist to photoetch a pattern on the third photoresist, wherein the projection of the second metal layer on the third photoresist is included in the pattern; and etching the transparent conductive film to form a transparent electrode layer and covering the second metal layer by the transparent electrode layer. According to the manufacturing method provided by the invention, the manufacturing cost of the array substrate is reduced, the manufacturing procedure of the array substrate is simplified and the production efficiency is improved. The array substrate and a liquid crystal display panel provided by the invention are relatively low in manufacturing cost.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display, in particular to a structure of an array substrate, a manufacturing method thereof, and a liquid crystal display panel. Background technique [0002] In the field of TFT-LCD manufacturing, it is always a trend to achieve the purpose of reducing manufacturing costs and improving equipment productivity by reducing the number of Masks and the number of photolithography processes. The TFT-LCD manufacturing process has developed from the initial 7-Mask production process to the 5-Mask and 4-Mask production technologies currently used by various LCD manufacturers in mass production, and the 3-Mask process technology has been developed. [0003] The existing 3-Mask technology utilizes a photoresist lift-off process in a semiconductor integrated circuit to complete the definition of transparent pixel electrode patterns. see Figure 1a First, the gate line layer 11 (M1) is photoetched thro...

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Problems solved by technology

[0004] Although the fabrication process of the array substrate completed by the above three masks is simpler than that of the array substrate completed by four masks and five masks, its fabrication process and final structure are still relatively complicated.

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