The invention relates to a Raised Pad manufacturing method, which comprises the steps of manufacturing an outer layer circuit, and the manufacturing of the outer layer circuit comprises the followingsteps of: S1, drilling the inner layer circuit of a PCB, entering a board electrical process, electroplating the whole board in an electroplating mode, and plating a layer of copper on the whole boardsurface and the wall of a drilled hole; S2, pressing a layer of photosensitive anti-corrosion film on the board surface subjected to plate electrification by using a hot roller film pressing machineto ensure the copper plating thickness; S3, manufacturing an outer layer circuit by adopting a developing machine, an etching machine and a film removing machine; S4, depositing a thin copper layer onthe independent units of the outer-layer circuit through copper deposition wires to enable the independent units to be connected together, and providing a conductor for subsequent electroplating; S5,pressing a layer of photosensitive anti-corrosion film on the board surface subjected to plate electrification by using a hot roller film pressing machine for manufacturing a PAD pattern for electroplating; and S6, placing the treated board on a copper plating wire to be subjected to copper plating operation, and obtaining the Raided Pad. The Raised Pad manufacturing method has the advantages ofthe simple process, low cost, high efficiency, the good product yield and the like.